Ion milling
= Ion milling
Removal of material by bombardment with energetic ions. Directional <sputtering> can transfer a mask pattern with less undercut than an isotropic wet etch; mask erosion, redeposition and surface damage remain possible.
= Ion milling
Removal of material by bombardment with energetic ions. Directional <sputtering> can transfer a mask pattern with less undercut than an isotropic wet etch; mask erosion, redeposition and surface damage remain possible.