= Precision Thermocouple Measurement with the ADS1118 by Mike Beckman and Luis Chioye
{c}
{tag=Work by Mike Beckman}
{tag=Work by Luis Chioye}
{title2=2013}
{title2=SLAU509}
https://www.ti.com/lit/ug/slau509/slau509.pdf
Section 2 discusses reference-junction thermal conditions. Section 6, p. 17, gives the compensation calculation; section 7, pp. 20–21, distinguishes varying the reference-junction temperature from varying the measurement-junction temperature. Section 9, p. 23, identifies both authors and their engineering roles at the time of publication.
Additional precise apparatus locator: Section 7, printed p. 20, Figure 17 places the ADS1118 EVM and reference junction in an oven or controlled thermal environment while the measurement junction stays at a fixed bath temperature; the USB interface and cable remain outside. Printed pp. 5–6 separately require isothermal terminal transitions and close thermal sensing, with metal-fill layout and airflow considerations. These are the physical controls used to distinguish compensation error from a changed measurement-junction temperature. https://www.ti.com/lit/ug/slau509/slau509.pdf
Additional cited passage: §4, printed p. 15, Figure 11, component placement, copper regions and thermal isolation of the converter/reference-junction region from nearby heat sources. https://www.ti.com/lit/ug/slau509/slau509.pdf[Printed p. 15, thermal layout]{ref}
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