= 350 nm process
{wiki=350_nm_process}
The term "350 nm process" refers to a semiconductor manufacturing process technology that uses a minimum feature size of 350 nanometers (nm). This indicates the smallest half-pitch of contactable features that can be reliably produced on a silicon wafer during the fabrication of integrated circuits (ICs). \#\#\# Key Points About 350 nm Process Technology: 1. **Process Node**: Each "process node" (like 350 nm) is a step in the evolution of chip manufacturing.
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