Source: wikibot/deep-reactive-ion-etching
= Deep reactive-ion etching
{wiki=Deep_reactive-ion_etching}
Deep reactive-ion etching (DRIE) is a semiconductor fabrication process used to create deep, well-defined structures in silicon and other materials. It is a variation of the reactive-ion etching (RIE) process, specifically designed for etching high aspect ratio features—where the depth of the etch is much greater than the width of the feature.