Source: wikibot/flip-chip-module
= Flip-Chip module
{wiki=Flip-Chip_module}
A Flip-Chip module is a type of electronic packaging technique that involves flipping an integrated circuit (IC) chip upside down and attaching it directly to a substrate or PCB (Printed Circuit Board) using solder bumps or balls. This method allows for shorter interconnections, which can improve electrical performance and reduce inductance and resistance compared to traditional packaging methods.