= System in a package
{wiki=System_in_a_package}
System in Package (SiP) is a type of semiconductor packaging technology that integrates multiple components, such as microprocessors, memory chips, passive components, and other electronic circuits, into a single package or module. This contrasts with traditional packaging approaches, where each component is housed separately. Key features of System in Package include: 1. **Integration**: SiP allows for the integration of heterogeneous components (e.g.
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