Source: wikibot/thermal-interface-material
= Thermal interface material
{wiki=Thermal_interface_material}
Thermal Interface Material (TIM) refers to materials used to enhance the thermal conductivity between two surfaces, typically between a heat-generating component (like a CPU, GPU, or power transistor) and a heat sink or other heat dissipation element. The primary purpose of TIM is to fill microscopic air gaps and irregularities between surfaces to improve thermal transfer efficiency.