= Transient liquid phase diffusion bonding
{wiki=Transient_liquid_phase_diffusion_bonding}
Transient Liquid Phase (TLP) Diffusion Bonding is a joining technique used primarily in materials engineering to bond similar or dissimilar materials together. This method is particularly effective for metallurgical joining of materials that may be challenging to weld or braze due to their differing thermal or mechanical properties. \#\#\# Key Concepts: 1. **Transient Liquid Phase**: In TLP bonding, a small amount of a liquid phase is created during the bonding process.
Back to article page
