= Wafer bonding
{wiki=Wafer_bonding}
Wafer bonding is a process used in semiconductor manufacturing where two or more semiconductor wafers are joined together to form a single, unified substrate. This technique is essential in various applications, including the production of integrated circuits, sensors, and MEMS (Micro-Electro-Mechanical Systems). There are several methods of wafer bonding, which can be categorized primarily into two types: 1. **Thermal Bonding**: This method involves applying heat and pressure to bond the wafers together.
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