Direct bonding, in a general context, refers to a method of joining materials or components without the use of intermediate layers or adhesives. It involves a strong, direct connection between the surfaces being bonded, often leading to enhanced mechanical and thermal properties of the joined materials. ### Applications of Direct Bonding: 1. **Microelectronics**: In semiconductor manufacturing, direct bonding is used to join silicon wafers or other materials at the molecular level, creating a robust interface without the need for adhesive layers.
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