Head-in-pillow defect
ID: head-in-pillow-defect
The Head-in-Pillow (HiP) defect is a type of manufacturing flaw that can occur in the production of electronic components, particularly in surface mount technology (SMT) solder joints. It is characterized by the appearance of a solder joint where a portion of the component (the "head") appears to be properly soldered, while another portion (the "pillow") is either poorly soldered or completely detached from the substrate.
New to topics? Read the docs here!