 IEEE Transactions on Advanced Packaging

IEEE Transactions on Advanced Packaging is a scholarly journal published by the Institute of Electrical and Electronics Engineers (IEEE) that focuses on the field of advanced packaging technology. This journal covers a wide range of topics related to the packaging of electronic components, including but not limited to: 1. **Design and Manufacturing**: Techniques and methodologies for designing and manufacturing electronic packages. 2. **Materials**: Research on materials used in packaging, including dielectrics, conductors, and substrates.