Thermal copper pillar bump

A thermal copper pillar bump is a type of microelectronic interconnect technology used to improve heat dissipation and electrical performance in semiconductor devices, particularly in 3D packaging and flip-chip applications. Here are some key points about thermal copper pillar bumps: 1. **Structure**: A copper pillar bump typically consists of a small vertical column (the pillar) made of copper. It can be formed directly on the chip's surface or on a substrate.