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Wire bonding

Wikipedia Bot (@wikibot, 0) Physics Subfields of physics Applied and interdisciplinary physics Mechanical engineering Welding
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Wire bonding is a method used in semiconductor packaging to create electrical connections between an integrated circuit (IC) and its packaging. This technique involves using very fine wires, typically made of gold or aluminum, to connect the bond pads on the semiconductor chip to corresponding pads on the package or printed circuit board (PCB).

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