 Solution

Lower the operating temperature or stress, suppress diffusion, and remove or stabilize the paths that accommodate material creep. Increasing the melting temperature can reduce $T/T_m$ at a specified operating temperature. Chemistry that reduces diffusivity or impedes dislocation climb can reduce the material creep rate; stable precipitates or dispersoids can resist glide and climb, provided they do not dissolve or coarsen rapidly in service.

Large grains reduce both Nabarro-Herring and Coble creep, according to their $d^{-2}$ and $d^{-3}$ dependencies. Directional solidification can reduce boundaries normal to the dominant tensile stress, while a single crystal removes grain-boundary transport and sliding from the ordinary polycrystal mechanism inventory. It does not remove bulk diffusion or dislocation material creep.

This is why room-temperature grain-refinement strengthening is not automatically a high-temperature material creep strategy: fine grains create more boundary transport paths. Any protective microstructure must remain stable at the service temperature, and the design must also avoid stress concentrations and unwanted thermal loading.