Fabrication of small structures from deposited, patterned surface films. A structural layer can be built on a sacrificial layer and released by selective removal of that support while retaining anchors. Film thickness sets a vertical dimension; residual stress, access to the sacrificial material and release-induced stiction require separate control.
A temporary material supporting another structure during fabrication, then removed selectively. In an oxide-supported polysilicon beam, selective oxide removal makes an air gap while protected substrate contacts retain anchors. Removal must reach beneath the structure without destroying it; a purely vertical etch may not release a lateral overhang.
Selective removal of a sacrificial layer using gaseous reactants rather than a bulk liquid bath. A compatible vapor-phase oxide etch can avoid the liquid drying step responsible for one form of stiction. Selectivity, byproducts, humidity and access to the undercut region still matter.

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Surface micromachining is a technology used to create microstructures and devices on the surface of a substrate, typically silicon, by depositing and etching thin films to form three-dimensional structures. It is one of the key techniques in microfabrication and is widely used in the production of microelectromechanical systems (MEMS), sensors, actuators, and other miniaturized devices.