Solder fatigue refers to the degradation or failure of solder joints in electronic assemblies due to repeated mechanical stress, thermal cycling, or vibrational forces. Over time, these stressors can cause the solder material to weaken, leading to cracks and eventually failure of the joint. Common causes of solder fatigue include: 1. **Thermal Cycling**: Solder joints can expand and contract as they experience temperature changes, which can result in thermal fatigue.
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