 Wafer bond characterization

Wafer bond characterization refers to the process of evaluating and analyzing the quality, properties, and performance of bonded wafers in semiconductor manufacturing and related fields. Wafer bonding is a critical technique used for fabricating complex microstructures by permanently joining two or more silicon or other semiconductor wafers together, creating a single integrated device. This technology is used in various applications, including microelectromechanical systems (MEMS), 3D integrated circuits, and advanced packaging.