Wafer bond characterization refers to the process of evaluating and analyzing the quality, properties, and performance of bonded wafers in semiconductor manufacturing and related fields. Wafer bonding is a critical technique used for fabricating complex microstructures by permanently joining two or more silicon or other semiconductor wafers together, creating a single integrated device. This technology is used in various applications, including microelectromechanical systems (MEMS), 3D integrated circuits, and advanced packaging.
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