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Incoming links: Professional profile of Robert Noyce
Robert Noyce Created 2026-10-18 Updated 2026-11-05
Robert Noyce devised a semiconductor device structure that integrates electrical connections with the semiconductor surface. His patent places conducting paths over an insulating layer and connects them to selected regions through openings in that layer. This makes interconnection part of fabrication rather than requiring every connection to be a separate external wire. The design connects surface insulation, device junctions and patterned conductors in the development of the integrated circuit.[ref]
Semiconductor device-and-lead structure by Robert Noyce. US2981877A, surface insulating layer, contact openings and deposited conducting leads
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Portrait of Robert Noyce
. Intel Free Press; existing Commons crop by Wabbuh. CC BY-SA 2.0, via Wikimedia Commons. Source..png){kind=link}