Sputtering ejects surface chemical atoms from a solid through bombardment by energetic incident particles, often ions.
A sputter-deposition method using a magnetic field near a target to confine electrons and sustain ionization efficiently. Multiple targets permit co-deposition. A local flux proportional to target power is a useful calibration model over a restricted range, rather than a universal linear law for composition or thickness.
Removal of material by bombardment with energetic ions. Directional sputtering can transfer a mask pattern with less undercut than an isotropic wet etch; mask erosion, redeposition and surface damage remain possible.
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Sputtering is a physical process used in various applications, particularly in materials science and semiconductor manufacturing. It involves the ejection of atoms or molecules from a solid target material due to bombardment by high-energy particles, typically ions. When these high-energy ions collide with the target surface, they can impart enough energy to dislodge atoms from it, leading to the ejection of atoms into the surrounding environment.