n-type doping adds donor impurities with weakly bound electrons near the conduction-band edge; ionization supplies conduction electrons and leaves positive donor ions. p-type doping introduces acceptors near the valence-band edge, producing holes and negatively charged ionized acceptors. Silicon and germanium commonly use group-V donors and group-III acceptors; dopant behaviour in a compound semiconductor depends on its lattice site.
Doping sets carrier concentration, Fermi level and resistivity. Spatially patterned donor and acceptor regions form p-n junctions, transistor source/drain regions and electrical contacts; remote doping can supply carriers to a cleaner conducting layer. Compensation and incomplete ionization mean carrier density need not equal the total impurity concentration.
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