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Heinz Horstmann is a researcher credited with the experimental development of serial block-face scanning electron microscopy. His 2004 paper with Winfried Denk describes repeatedly cutting a resin-embedded sample and imaging the newly exposed surface inside a scanning electron microscope. Its contribution statement credits both authors with performing experiments and supplying materials or analysis tools.^[ref]

The apparatus addresses a practical reconstruction problem. Collecting separate thin sections can introduce handling and alignment difficulties; imaging the remaining block face after each cut retains a more directly ordered sequence of surfaces. A moving knife and a controlled specimen advance turn sectioning and imaging into repeated steps within the instrument.^[ref]

The specimen advance used a lever to reduce the displacement of a motorized micrometer by a ratio of $0.11$. Applied to the quoted $50\mathrm{nm}$ actuator-position uncertainty, this gives $0.11\times 50=5.5\mathrm{nm}$ at the reduced-motion side. This is the scaled contribution of that actuator uncertainty, not a measurement of the total uncertainty in every removed section.^[ref]

A separate constructed sampling example highlights an interpretation limit. Two hundred nominal $50\mathrm{nm}$ layers cover $10\mu \mathrm{m}$ in depth. If the lateral pixels are $5\mathrm{nm}$ wide, depth sampling is ten times coarser. Interpolating the image stack onto smaller depth steps can make a display smoother but does not supply observations of the missing intermediate planes. Horstmann and Denk's work therefore connects instrument mechanics with the geometry and limits of a three-dimensional biological reconstruction.

Serial block-face scanning electron microscopy acquires a three-dimensional dataset by repeatedly imaging an exposed specimen face in a scanning electron microscope and removing a thin layer with an ultramicrotome. The removed layer is not the imaged object: each image records the newly exposed block face. This differs from collecting and imaging thin sections in serial-section electron microscopy.^[ref]

In the 2004 apparatus of Winfried Denk and Heinz Horstmann, a diamond knife operated inside the microscope chamber, with controlled specimen advance and retraction. A backscattered electron signal supplied image contrast. Keeping the cutting and imaging operations in the chamber enabled automated image stack acquisition.^[ref]

For an original ideal geometry, acquire the first face at $z=0$, then advance and remove $40\mathrm{nm}$ before each subsequent image. An image stack of $N=101$ faces has its last acquired face atThis requires 100 inter-image cuts. If a data format assigns each face a $40\mathrm{nm}$-deep voxel, its nominal represented thickness is instead $N\Delta z=4.04\mu \mathrm{m}$. State which extent is intended. At lateral pixel pitch $5\mathrm{nm}$, the sampling ratio $\Delta z/p$ is 8.

The resulting image stack needs image registration and a calibrated cutting coordinate. Lateral position jitter, cutting artifacts and the depth range contributing to the electron signal limit the useful reconstruction. Finite voxel spacing is not itself a measurement of spatial resolution. Destructive cutting also means that later imaging cannot recover an exposed face that has already been removed.

Serial-section electron microscopy reconstructs a volume from an ordered image stack of thin physical slices. In the transmission electron microscopy implementation, an ultramicrotome cuts successive slices, which are collected on a support and imaged through the specimen. Image registration aligns corresponding features; image segmentation identifies structures to follow between slices. JEOL's glossary describes sections of 40–100 nm and illustrates the separate registration and segmentation stages.^[ref]

The motivation is geometrical: one isolated slice cannot show whether a feature continues, divides, or ends outside that slice. An ordered image stack provides observations along the third coordinate, although finite section-thickness anisotropy and missing material limit what can be inferred. A change between neighboring images may come from specimen structure, a slice deformation, or imperfect image registration.

For a chosen numerical example, suppose each of $N=200$ consecutive sections has uniform thickness $\Delta z=50\mathrm{nm}$, with lateral pixel pitch $p=4\mathrm{nm}$. Ignoring lost material and thickness variation, the sections coverThe voxel sampling is 12.5 times coarser along the cutting direction. These are chosen dimensions, not measurements from either cited experiment. The first and last section centers are only $(N-1)\Delta z$ apart: center-to-center extent differs from total represented thickness. Neither spacing is automatically the achieved spatial resolution.

Image resampling onto a cubic grid can make an image stack easier to display, but interpolation supplies no additional independent observations. Likewise, smooth image registration cannot resolve missing-section ambiguity in volume reconstruction: a small connecting feature could lie wholly inside lost material. Checking a reconstructed connection therefore needs evidence in the acquired slices, not just a visually smooth rendered surface.

A historically important automation change illustrates the distinction between section and surface imaging. In 2004, Winfried Denk and Heinz Horstmann placed an ultramicrotome with a diamond knife inside a scanning electron microscope. Their serial block-face scanning electron microscopy imaged the exposed block surface between cuts instead of collecting the removed sections. They reported stacks several hundred layers deep, 50–70 nm sectioning, and typically less than 10 nm lateral position jitter. These observations tested an apparatus for acquiring closely aligned serial images; they did not remove the finite spacing between observations.^[ref]

A mechanical detail makes the measurement chain concrete. Their specimen-advance lever reduced the motorized micrometer's motion by 0.11. Thus its stated position measurement uncertainty of 50 nm contributed $0.11\times 50=5.5\mathrm{nm}$ after that reduction; other sources of section-thickness error still required assessment.^[ref]