A radiation-sensitive patterning film. Positive resist becomes more soluble after suitable exposure; processing sets its dose response.
Selective dissolution of resist after exposure to reveal the written pattern.
A photoresist whose exposed regions dissolve faster in the developer than unexposed regions.
A photoresist whose exposed regions become less soluble in developer over the relevant process window, so adequately exposed regions remain after development.
Radiant energy per exposed area. For steady intensity and exposure duration , ; the developed photoresist profile also depends on chemical processing.
The inverse logarithmic dose range between retention and clearing, . Larger contrast permits a smaller aerial-image intensity ratio.
The smallest aerial-image modulation that permits full clearing in bright regions while preserving the initial thickness in dark regions.

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Photoresist is a light-sensitive material used in various photolithography processes, commonly found in the manufacturing of semiconductors, microelectronics, and printed circuit boards. It is applied as a liquid and then coated onto a substrate, such as silicon wafers. Here’s how photoresist works: 1. **Application**: A liquid photoresist is uniformly applied to the surface of a substrate.