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An intrinsic semiconductor has negligible electrically active impurity doping, and thermal excitation across its band gap produces equal electron and hole densities $n=p=n_i$. In an extrinsic sample, semiconductor doping supplies donor impurities or acceptor impurities, so one carrier species dominates over a range of temperatures. Doping does not remove the possibility of low-temperature dopant freeze-out or high-temperature intrinsic behavior.

Assume parabolic isotropic band edges, spin degeneracy two, a single valley, thermal equilibrium and nondegenerate carriers. Write $E_F$ for the Fermi level, and measure conduction-band energy by $E=E_c+ϵ$. Counting momentum states gives the density of states per unit volumeThe low-occupation Maxwell–Boltzmann statistics givesThe substitution $x=ϵ/(k_{B}T)$ and ${\int }_0^{\infty }\sqrt{x}{e}^{-x}dx=\sqrt{\pi }/2$ give the coefficient. Similarly $p=N_v{e}^{(E_v-E_F)/(k_{B}T)}$ and $N_v=2[m_h^{\ast }{k}_{B}T/(2\pi {\hslash }^2){]}^{3/2}$. Multiplication eliminates $E_F$, proving the semiconductor mass-action lawHere the supplied effective masses are treated as the masses entering the effective density of states. A detailed multivalley silicon model would require the appropriate valley degeneracy and density-of-states masses consistently; adding an extra factor without changing the stated model would alter the requested expression.

A pentavalent arsenic impurity supplies a weakly bound excess electron. In the hydrogenic donor state approximation, dielectric screening reduces the Coulomb attraction and the band effective mass replaces the free mass. Hence the donor binding energy isThis is the effective-mass estimate, without a material-specific central-cell correction.

For the temperature plot use donor density $N_D=10^{15}{\mathrm{cm}}^{-3}$ and no acceptors. The charge neutrality with partial donor ionization model puts $E_D=E_c-E_b$ and includes the twofold spin degeneracy of an occupied donor:These equations give three regimes. At low temperature, $p$ is negligible and strong dopant freeze-out gives $n\simeq \sqrt{N_D{N}_c/2}{e}^{-E_b/(2k_{B}T)}$. At intermediate temperature, the donors are almost ionized and intrinsic holes remain rare, so $n\simeq N_D$. At high temperature, $n\simeq p\simeq n_i\propto T^{3/2}{e}^{-E_g/(2k_{B}T)}$. Thus the log-density plot against inverse temperature has a steep intrinsic segment on the left, a nearly horizontal extrinsic plateau, and a freeze-out decline on the right; the $T^{3/2}$ and $T^{3/4}$ factors give slight curvature.

To quantify “approximately constant”, require $0.9N_D\le n\le 1.1N_D$. At $300\mathrm{K}$, the specified model gives $N_c\simeq 4.12\times 10^{18}$, $N_v\simeq 8.61\times 10^{18}$ and $n_i\simeq 2.33\times 10^9{\mathrm{cm}}^{-3}$. The full neutrality equations give the ten-percent plateau intervalThe lower boundary is set by donor ionization and the upper boundary by intrinsic electron-hole production. The large ratio $N_c/N_D$ allows substantial donor ionization even when $k_{B}T<E_b$; using only $k_{B}T\gg E_b$ would incorrectly exclude much of the plateau. The quoted interval depends on the chosen tolerance and the constant-gap band model, rather than being an exact measured range for arsenic-doped silicon.

A positive electric potential difference between gate and substrate attracts electrons towards the insulating interface and repels the mobile electron holes of the p-type semiconductor substrate. The exposed, negatively charged acceptor impurities form a depletion region; the thin mobile electron layer at its surface is the semiconductor inversion layer. The conduction band and valence band bend downwards towards the positively biased gate, because the electron potential energy is $-e\psi$.

To specify the conventional MOS inversion threshold, let $N_A$ be the ionized acceptor density, $n_i$ the intrinsic carrier concentration, andIn the neutral bulk the intrinsic level lies $e{\varphi }_F$ above the semiconductor chemical potential. A positive surface potential ${\psi }_s$ lowers both band edges by $e{\psi }_s$, giving, in the nondegenerate approximation,At ${\psi }_s={\varphi }_F$, the surface is intrinsic: $n_s=p_s=n_i$. The usual onset of strong inversion instead meansThus the surface electron density has grown to the bulk majority-carrier density. The chemical potential need not actually enter the conduction band. The phrase “just forms” can also refer to the earlier weak-inversion crossover; the diagram uses the conventional strong-inversion threshold and labels it explicitly.

Within the depletion approximation the negative space charge is approximately $-e{N}_A$ over a widthwhere ${ϵ}_s$ is the absolute semiconductor permittivity. Its outer edge is where the bands become flat and mobile electron holes recover their bulk density. The electrical insulator blocks steady carrier transport while sustaining an electric field; the metal gate supplies positive surface charge balancing depletion and inversion charge. Under gate bias, the gate and substrate electrochemical potentials are different, so a single equilibrium Fermi level should not be drawn through the whole biased stack.

Ordinary doped semiconductor devices need a regime where their donor impurities or acceptor impurities supply mobile charge carriers while intrinsic thermal excitation remains sufficiently small.

At low temperature, donor impurities or acceptor impurities may no longer be ionized. Dopant freeze-out reduces the carrier density, raises electrical resistance and changes the intended carrier injection and p-n junction response. At high temperature the intrinsic carrier concentration grows aswhen band effective masses and band gap are treated as constant. Once it becomes comparable with the net doping density, it overwhelms the intended electron-hole imbalance; reverse leakage and dissipation increase and useful p/n control is lost.

The usual operating window lies between freeze-out and intrinsic conduction, with mobility and thermal management placing further practical limits. This is a statement about conventional doped-device operation, not a fundamental prohibition on engineered cryogenic or wide-bandgap devices.

A p-n junction joins regions of a semiconductor with opposite majority charge carriers: electrons on one side and electron holes on the other. It provides the junction modeled by the Shockley diode equation.

Near an unbiased p-n junction, diffusion leaves exposed ionized donor impurities and acceptor impurities. Their electric field opposes further majority-carrier transfer. At thermal equilibrium, drift and diffusion balance; there is no net electric current. Forward bias reduces the barrier to carrier injection; reverse bias enlarges it. A heavily doped tunnel diode adds a different transport route, quantum tunnelling, that the ordinary Shockley diode equation omits.

The controlled introduction of impurities to change a semiconductor's charge carrier populations. Donor impurities and acceptor impurities can produce an n-type semiconductor or a p-type semiconductor, respectively; compensation and temperature also matter.

Shuji Nakamura is an electrical engineer whose work helped make efficient blue light-emitting diodes possible using gallium nitride and indium gallium nitride. His work combined improved material growth, activation of p-type semiconductor and the design of an emitting active layer.^[ref]

One crucial result concerned hydrogen binding to magnesium acceptor impurities in gallium nitride. The resulting complexes suppress their electrical activity; thermal treatment can remove that passivation. In an emitting semiconductor heterostructure, injected electrons and holes recombine in an active layer with a smaller band gap than the surrounding material, helping confine the carriers where light is produced. This connects material chemistry with an operating electronic device.^[ref]

Substitutional semiconductor doping replaces selected host atoms with impurity atoms on ordinary lattice sites. A shallow donor impurity can supply a mobile conduction electron and remain positively charged; a shallow acceptor impurity can capture an electron and leave a mobile valence hole, remaining negatively charged. In nondegenerate, substantially ionized material, donor-dominated doping raises the chemical potential toward the conduction edge and acceptor-dominated doping lowers it toward the valence edge. Dopants do not create net bulk charge in a neutral sample: fixed impurity charge compensates the mobile carrier charge. Freeze-out, compensation and degeneracy qualify the simplest relation between dopant and carrier densities.