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An amphoteric dopant can act as a donor impurity or an acceptor impurity according to its incorporated lattice site or defect configuration. Silicon in gallium arsenide is the standard example: substitution on the gallium sublattice gives a shallow donor, while substitution on the arsenic sublattice gives a shallow acceptor. Its electrical effect therefore depends on growth conditions as well as total silicon concentration.^[ref]

A compensated semiconductor contains both donor impurities and acceptor impurities. In a nondegenerate equilibrium model with both species fully ionized, charge neutrality gives $n-p=\Delta =N_D-N_A$, while the semiconductor semiconductor mass-action law gives $np=n_i^2$. Solving yieldsFor $\Delta >0$ and $n_i\ll \Delta$, $n\simeq \Delta$ and $p\simeq n_i^2/\Delta$. Numerically the minority concentration is better obtained as $n_i^2/n$ than by subtracting nearly equal numbers. If dopants are only partly ionized, replace $N_D,N_A$ in charge neutrality by their ionized concentrations and determine the chemical potential self-consistently.

The region around a p-n junction with reduced mobile charge carrier density.

An illustrative abrupt-junction depletion approximation assumes uniform, fully ionized donor impurities and acceptor impurities, negligible mobile space charge in the depleted layer, and permittivity ${\epsilon }_s$. For area $A$, doping number densities $N_A,N_D$ and built-in electric potential difference $V_{\mathrm{bi}}$, it givesHere $q>0$ is the elementary charge and $V$ is positive for forward bias. Increasing both doping densities reduces $W$ in this estimate. That explains the preparation strategy for a tunnel diode; it does not make this sharp-depletion approximation a precise microscopic model of a degenerate semiconductor.

Leo Esaki's 1958 report describes alloy-fabricated germanium p-n junctions, with acceptor impurity concentration $1.6\times 10^{19}{\mathrm{cm}}^{-3}$ and donor impurity concentration approximately $10^{19}{\mathrm{cm}}^{-3}$. Its readout was the current-voltage characteristic: a forward peak occurred at $0.035\pm 0.005\mathrm{V}$. The report says specimens could be reproduced; above $0.3\mathrm{V}$ the forward branch approximately followed the ordinary Shockley diode equation.^[ref]

In his 1973 lecture, Leo Esaki recalls an earlier junction whose strong room-temperature reverse conduction preceded a negative-slope forward segment revealed by cooling. Its estimated zero-bias width was about $200$ ångströms ($20\mathrm{nm}$), supported by capacitance measurements. Increasing semiconductor doping further made the negative slope visible across the measured temperatures, including room temperature. Thus preparation and temperature variation were experimental controls, not merely changes to a theoretical diagram. The low onset voltage argued against avalanche production of electrons and electron holes; the energy band explanation connected the forward decline to loss of available final states.^[ref]

The historical readouts were junction electric current versus applied electric potential difference and a separate capacitance check; preparation and temperature were varied. The cited descriptions do not identify a meter model or give a complete wiring diagram.

For a modern repetition, measure junction voltage directly while stepping the supply and recording electric current, repeat both sweep directions, and compare temperatures and differently doped specimens. These are proposed controls, not a reconstruction of the historical apparatus. Lead electrical resistance, Joule heating, contact quality and voltage resolution can obscure the result. The tunnel-diode load-line stability calculation also predicts that an external resistor can make a negative-slope operating point inaccessible in a slow sweep. A jump in terminal readings then need not mean the underlying current-voltage characteristic is discontinuous.

An extrinsic semiconductor has mobile electron and electron hole populations substantially controlled by electrically active impurities rather than solely by intrinsic thermal pair production. Donor impurities favor electron conduction and acceptor impurities favor hole conduction. Ionization, compensation and the temperature-dependent intrinsic population determine whether a given doped specimen is actually in its extrinsic transport regime.

Isamu Akasaki chose metalorganic vapour-phase epitaxy and sapphire, which tolerated hot Ammonia. Large lattice mismatch hindered film growth. In 1985, Hiroshi Amano and Isamu Akasaki's group developed an aluminium nitride epitaxial buffer layer deposited before hotter gallium nitride growth. The buffer supplies initial growth sites; growing islands join into a continuous film. It improves growth without making the lattices identical. Isamu Akasaki separately credits Shuji Nakamura's 1991 gallium nitride buffer.^[ref]

The 1986 growth paper reports a vertical metalorganic vapour-phase epitaxy reactor, source gases mixed just before delivery to slanted sapphire, and subsequent gallium nitride growth over aluminium nitride. Surface microscopy, X-ray diffraction and photoluminescence tested different aspects of the result. Buffered and unbuffered growth supplied the comparison. Its reported preparation conditions should not be replaced by one universal buffer temperature: the later lecture's account of the first low-temperature trial and the paper's parameter study describe different stages of development.^[ref]

A magnesium acceptor impurity in gallium nitride accepts a valence band electron, leaving a mobile electron hole. Hydrogen passivation of magnesium acceptors in gallium nitride suppresses this activity. Post-growth activation restores existing impurities' electrical activity; ionization of active acceptor impurities supplies mobile electron holes. Adding magnesium alone is insufficient.^[ref]

In 1989, Hiroshi Amano, Masahiro Kito, Kazumasa Hiramatsu and Isamu Akasaki obtained p-type semiconductor conduction in magnesium-doped gallium nitride using low-energy electron beam irradiation. Hiroshi Amano recalls initially resistive samples, an unreliable hot-probe test, then Masahiro Kito's Hall effect confirmation. A junction irradiated in an M-shaped region emitted in that pattern. Treatment, carrier-sign measurement and spatial emission supplied different evidence. Earlier zinc-doped samples brightened under irradiation without becoming p-type semiconductors: brightness alone did not prove the carrier sign.^[ref]

Shuji Nakamura, Takashi Mukai, Masayuki Senoh and Naruhito Iwasa's 1992 thermal-activation paper established another route using annealing in nitrogen. Their companion study compared already conducting films heated in nitrogen with films heated in Ammonia: the latter became highly resistive again. Its hydrogen-complex explanation connected this atmosphere dependence to acceptor impurity passivation. These are thermal treatment and atmosphere comparisons, distinct from the earlier electron beam intervention; neither observation alone images an individual hydrogen complex.^[ref][ref]

Shuji Nakamura's two-flow metalorganic chemical vapor deposition reactor, gallium nitride buffer, thermal activation and improved indium gallium nitride growth enabled bright double heterostructure devices, followed by thinner quantum well devices.^[ref]

The original 1994 paper by Shuji Nakamura, Takashi Mukai and Masayuki Senoh describes a sapphire/gallium nitride-buffer device with zinc-doped indium gallium nitride emission and aluminium gallium nitride confinement. After nitrogen annealing, etching exposed the n-side for a separate contact. At room temperature, varied forward electric currents gave emission spectra and optical-output curves alongside a current-voltage characteristic. At $20\mathrm{mA}$: $1.5\mathrm{mW}$ output, $450\mathrm{nm}$ peak wavelength, $3.6\mathrm{V}$ terminal electric potential difference. The peak stayed nearly fixed across the current series. The paper omits a complete calibrated collection apparatus; comparisons with earlier devices change several preparation details.^[ref]

In gallium nitride, incorporated hydrogen can neutralize magnesium acceptor impurities. Activation treatments restore electrical activity; adding magnesium alone does not establish a mobile electron hole population.

An impurity level is an electronic energy level associated with a dopant or defect in a semiconductor. A shallow donor impurity introduces a level just below the conduction band, and a shallow acceptor impurity introduces one just above the valence band. Under electrostatic band bending, these levels shift with the local band edges in the same material; their occupation is determined relative to the equilibrium chemical potential.

Naruhito Iwasa coauthored experiments on p-type semiconductor behavior in gallium nitride. Contrasting annealing in nitrogen and ammonia linked changes in electrical resistivity to hydrogen; the authors proposed neutral complexes of hydrogen and acceptor impurities as a mechanism reducing mobile electron holes.^[ref]

Gallium has three valence electrons, one fewer than silicon, and acts as an acceptor impurity. A neutral acceptor can be described as a negatively charged centre binding an electron hole. Thermal release of these holes gives a p-type semiconductor.

At low temperature, the bound hole can absorb far-IR photons in transitions between acceptor levels. The simplest scalar hydrogenic acceptor state model predictsso one expects a discrete bound-hole absorption series followed by a photoionization continuum. In that idealization, the first lines would be at $3R_A^{\ast }/4$, $8R_A^{\ast }/9$ and $15R_A^{\ast }/16$, with threshold $R_A^{\ast }$.

The hole effective mass is not supplied, so the electron mass $0.2m_e$ cannot be reused to give numerical Ga line positions. In a real valence band, multiple hole bands, anisotropic masses and spin-orbit effects can split and complicate the series; acceptor spectra are generally less accurately described by one scalar hydrogenic ladder.^[ref]

Three routes are donor doping, acceptor doping and above-gap illumination. All increase mobile carrier populations if the added states or excitations are effective rather than strongly trapped.

An appropriate donor impurity provides an occupied level just below the conduction band. Thermal ionization requires the smaller donor binding energy rather than the full host gap, supplying mobile electrons and n-type semiconductor behaviour. An appropriate acceptor impurity creates an available level just above the valence band; accepting a valence electron leaves a mobile hole, giving p-type semiconductor behaviour. Doping concentrations and compensation must permit useful carriers; an arbitrary impurity need not be an effective dopant.

For photoconductivity, absorbed photons with $h\nu \gtrsim E_g$ can excite valence electrons into the conduction band, producing electron–hole pairs. For the stated $2.7\mathrm{eV}$ gap, the nominal threshold is about $1240/2.7\simeq 459$ nm. Optical selection rules and absorption strength can shift the practical onset. The conductivity increase persists only while generation maintains carriers against recombination and trapping; it is not necessarily a permanent change to the material.

In each case, $\sigma =e(n{\mu }_n+p{\mu }_p)$ connects increased carrier density to conductivity. Defect-induced reductions in mobility can offset some of the gain, so the diagrams specify mechanisms rather than guarantee a numerical improvement for an unspecified preparation.

An intrinsic semiconductor has thermally generated conduction electrons and valence holes, with $n=p=n_i$ at equilibrium in the ideal undoped neutral material. Their abundance is controlled by its band gap, temperature and band density of states.

An extrinsic semiconductor has its mobile carrier populations substantially modified by electrically active impurities. A donor impurity can supply electrons, producing n-type material; an acceptor impurity can capture a valence electron and leave a mobile electron hole, producing p-type material. Compensation and incomplete ionization can modify these simple counts. At low temperature dopant freeze-out can occur; at sufficiently high temperature intrinsic pair production can overwhelm a fixed dopant density. Doping and the dominant transport regime are related but are not interchangeable descriptions at every temperature.

The sign must become positive, so use p-type acceptor impurities, such as boron substituting for tetravalent silicon. Assume uncompensated, fully ionized acceptors of density $N_A$, nondegenerate carriers and equilibrium throughout the interval. Charge neutrality and mass action giveFor a nearly constant hole-dominated Hall coefficient, the dopant plateau must persist up to the highest temperature. Its necessary concentration scale is thereforeThe order-of-magnitude onset is $N_A\sim 4\times 10^{20}{\mathrm{m}}^{-3}$, but equality is not a flat plateau: at $N_A=n_i(500)$, $p/N_A=(1+\sqrt{5})/2=1.618$, changing the hole-only Hall coefficient by about 38 percent. The word approximately does not define a unique sharp minimum without a tolerance.

For $N_A\gg n_i$, $p\simeq N_A[1+(n_i/N_A{)}^2]$, so the hole-only $R_H\simeq 1/(e{N}_A)$ varies by a fraction of order $(n_i/N_A{)}^2$. An illustrative one-percent tolerance in that approximation is obtained with $N_A\simeq 10n_i(500)=4.0\times 10^{21}{\mathrm{m}}^{-3}$. This gives $R_H\simeq +1.56\times 10^{-3}{\mathrm{m}}^3{\mathrm{C}}^{-1}$ and less than one percent hole-density-induced variation. It is an explicit plateau criterion, not an exact minimum deduced from the unspecified word approximately.

At 300 K the minority electron concentration isThus the onset-scale estimate gives about $2.5\times 10^{11}{\mathrm{m}}^{-3}$, whereas the explicit ten-times-larger plateau choice gives $2.5\times 10^{10}{\mathrm{m}}^{-3}$.

The acceptor density for a stable Hall sign can be more restrictive if both carriers matter. With mobility ratio $r_{\mu }={\mu }_e/{\mu }_h>1$, positive Hall sign requires $p>r_{\mu }{n}_i$, or $N_A>n_i(r_{\mu }-r_{\mu }^{-1})$. In the strongly extrinsic limit the full two-carrier Hall correction scales as $(1+r_{\mu }{)}^2(n_i/N_A{)}^2$, not just $(n_i/N_A{)}^2$. Hence a true measured-Hall tolerance can require a larger dopant density than the hole-only illustration. Mobilities and their temperature dependence are not supplied, so they cannot be used to manufacture a unique sharper minimum.

A periodic lattice Hamiltonian commutes with lattice translations. The Bloch theorem therefore classifies its states by characters of the translation group:where $u$ is lattice periodic. For each crystal momentum $\mathbf{k}$, solving on a primitive cell with the corresponding quasiperiodic boundary condition gives discrete eigenvalues indexed by $n$. Their continuous dependence on $\mathbf{k}$ produces the energy bands $E_n(\mathbf{k})$ as $\mathbf{k}$ ranges through the Brillouin zone. Bragg mixing opens gaps at suitable degeneracies, although bands can overlap in three dimensions and gaps are not guaranteed between every pair.

The quantum numbers are band index, wavevector modulo reciprocal lattice vectors, and spin where spin is conserved. In a finite crystal the allowed wavevectors are discrete; in the thermodynamic limit they become dense and the band description emerges. Spin-orbit coupling can replace a separately conserved spin label by an appropriate internal band label.

Dilute randomly placed impurities break exact translation symmetry, so crystal momentum is no longer an exact quantum number. Most extended states retain approximately the host band structure but acquire impurity scattering and disorder broadening. An impurity potential can also produce impurity levels in a crystal, often in a band gap: levels associated with a donor impurity lie near the conduction-band edge and can supply electrons, while those associated with an acceptor impurity lie near the valence-band edge and can create holes. The impurity's species and potential determine whether such levels exist and how deep they are; not every impurity necessarily makes a gap state. At low density these levels are nearly isolated, while overlap at increasing density can broaden them into an impurity band. Added or removed carriers shift the chemical potential as well.

A completely filled valence band carries no net current: its occupied crystal-momentum states have velocities that cancel. Near a valence-band maximum, an almost full band is conveniently described by the few missing electrons, or electron holes. Removing an electron of charge $-e_0$, with $e_0>0$, changes the charge relative to the filled band by $+e_0$. This is a quasiparticle description of electronic motion, not a mobile positive ion or a Positron.

For an isotropic parabolic maximum, ${ϵ}_v(\mathbf{k})=E_v-{\hslash }^2{k}^2/(2m_h^{\ast })$. Assign the missing-electron state momentum ${\mathbf{k}}_h=-{\mathbf{k}}_e$ and hole energyIt has positive effective mass $m_h^{\ast }$. Its velocity equals the velocity of the missing electron state, and its positive-charge current replaces the negative of that state's electronic current. Semiclassical motion is thus $\hslash {\dot{\mathbf{k}}}_h=+e_0(\mathbf{E}+{\mathbf{v}}_h\times \mathbf{B})$. With momentum relaxation time ${\tau }_h$, the low-field mobility is ${\mu }_h=e_0{\tau }_h/m_h^{\ast }$ andIf electrons also contribute, $\sigma =e_0(p{\mu }_h+n{\mu }_e)$: the two species' longitudinal conductivities add.

A Hall bar separates carrier concentration from mobility. Apply current density $j_x$, magnetic field $B_z$, and measure transverse electric field $E_y$. For one isotropic hole population, transverse force balance gives $E_y=v_x{B}_z$, soFor thickness $t$, the Hall-voltage magnitude is $|V_H|=IB/(e_{0}pt)$. A longitudinal four-terminal resistance measurement supplies $\sigma$ independently. Use ohmic contacts, known conducting thickness, controlled temperature and low enough current to avoid self-heating. Reversing magnetic field removes even-in-field longitudinal offsets from contact misalignment; reversing current also helps reject thermoelectric offsets. These are central controls, rather than merely taking one transverse voltage reading.^[ref]

The simple inference assumes one carrier type and a known Hall scattering factor. More generally $R_H=r_H/(e_{0}p)$, so $\sigma R_H$ measures Hall mobility rather than automatically the drift mobility. With two carrier populations at weak field,Its sign alone need not identify the more numerous carrier. A Hall experiment also cannot determine $m_h^{\ast }$ and ${\tau }_h$ separately: their ratio sets mobility. cyclotron resonance supplies an independent mass measurement by sweeping frequency or magnetic field through $\omega =e_{0}B/m_c$ and detecting resonant absorption. The measured cyclotron effective mass can depend on band anisotropy and need not equal every curvature mass; the isotropic parabolic model identifies them. Its linewidth provides a scattering-time estimate only with a specified damping model.

semiconductor doping generates holes by adding acceptor impurities. In silicon, a substitutional group-III atom such as boron provides one fewer valence electron than silicon. A shallow acceptor level lies slightly above the valence-band edge: accepting a valence electron makes the dopant negatively ionized and leaves a mobile hole in the valence band. The impurity stays fixed in the lattice. charge neutrality and the nondegenerate equilibrium mass-action law giveFor fully ionized, uncompensated acceptors in the extrinsic regime, $p\simeq N_A$ and $n\simeq n_i^2/N_A$; with fully ionized donor compensation, $p\simeq N_A-N_D$ while holes remain dominant. The Fermi level moves towards the valence band. At low temperature, semiconductor carrier freeze-out suppresses mobile electron holes; at high temperature intrinsic electron-hole generation can dominate. Increasing dopant density also changes scattering, so a conductivity increase alone cannot distinguish increased carrier density from changed mobility. Temperature-dependent Hall and conductivity measurements separate these effects, subject to the carrier and scattering qualifications above.

Semiconductor doping introduces impurities with levels close to the band edges. A donor impurity can release an electron to the conduction band, leaving a fixed positive ion; an n-type semiconductor has electrons as majority carriers. An acceptor impurity can take an electron from the valence band, leaving a mobile hole and fixed negative ion; a p-type semiconductor has holes as majority carriers. The opposite species remains as a minority carrier population, and a neutral bulk sample balances the ionised dopants with mobile carriers.

At a p-n junction, concentration gradients initially drive electrons and holes across the join. Their removal near the join exposes negative acceptor ions on the p side and positive donor ions on the n side, forming a depletion region. Its electric field opposes further majority-carrier diffusion. Equilibrium has a flat Fermi level, no net current and spatially bent band edges. With p on the left and n on the right, the electron band edges fall towards the n side; the difference is the equilibrium barrier in electron energy. A flat Fermi level does not mean flat conduction and valence edges.

Doping changes the mobile carrier population by introducing controlled impurity levels. In an intrinsic semiconductor, the filled valence band is separated from the nearly empty conduction band by a band gap $E_g$. Thermal excitation produces an electron-hole pair, so the electron and hole number densities obey $n=p=n_i$. A electron hole represents a missing valence-band electron and behaves as a mobile positive charge carrier. For nondegenerate bands in thermal equilibrium,Here $N_C,N_V$ are the effective density of states, $E_C,E_V$ the band edges, and $E_F$ denotes the chemical potential, conventionally called the Fermi level. The semiconductor mass-action law holds in this nondegenerate equilibrium regime.

In a tetrahedrally bonded elemental semiconductor such as silicon, a substitutional group-V atom has an extra outer electron relative to the host. It is a donor impurity: a shallow level just below $E_C$ can ionise, releasing an electron to the conduction band and leaving a fixed positively charged donor. The resulting n-type semiconductor has electrons as majority carriers and holes as minority carriers. Conversely a group-III substitution supplies one fewer bonding electron. An acceptor impurity can take an electron from the valence band, leaving a mobile electron hole and a fixed negative acceptor; the resulting p-type semiconductor has holes as majority carriers.

The impurity state is shallow because the electron or hole responds to a screened Coulomb potential and an effective mass, rather than the bare atomic potential. A simple hydrogenic donor estimate iswhere ${ϵ}_r$ is the relative permittivity. This is a useful scaling model, with real band anisotropy and central-cell effects omitted. Dopants are fixed in the lattice; their ionisation changes mobile carrier numbers without making a uniformly doped bulk sample carry a large net electric charge.

The charge neutrality condition isWhen shallow dopants are almost fully ionised and $N_D-N_A\gg n_i$, an n-type region has $n\simeq N_D-N_A$ and $p\simeq n_i^2/n$. A p-type region similarly has $p\simeq N_A-N_D$ and $n\simeq n_i^2/p$. Thus compensation by the opposite impurity type reduces the majority-carrier density; the total dopant concentration is not generally the mobile carrier density. At sufficiently high impurity density the degenerate semiconductor regime requires the full Fermi-Dirac distribution and these exponential approximations fail.

There are three useful temperature regimes. At low temperature, dopant freeze-out leaves many shallow levels un-ionised. In the extrinsic regime, the dopants are largely ionised and set the majority-carrier density. At high enough temperature, intrinsic pair creation dominates and $n,p$ approach $n_i$. The Fermi level moves towards the conduction band with donor doping and towards the valence band with acceptor doping. The electrical conductivity isDoping therefore controls conductivity and its carrier type, but ionised impurities also scatter carriers and can reduce charge carrier mobility. Carrier density and mobility must both be considered.

A p-n junction forms when p-type and n-type regions are joined within a semiconductor. Initially the concentration gradients drive diffusion current: electrons diffuse from the n region to the p region and holes in the opposite direction. Recombination removes mobile majority carriers near the join, exposing fixed positive donors on the n side and fixed negative acceptors on the p side. This forms a depletion region and an electric field directed from n to p. Its drift current opposes diffusion. At equilibrium the net current vanishes and the Fermi level is uniform, although the band edges vary spatially through band bending.

For an abrupt nondegenerate junction with fully ionised dopants, its built-in potential isUnder the depletion approximation, the space-charge densities are $-e{N}_A$ on a p-side width $w_p$ and $+e{N}_D$ on an n-side width $w_n$. Integrating Poisson equation and imposing zero field outside gives $N_A{w}_p=N_D{w}_n$ andMost of the depletion width therefore extends into the more lightly doped side. The schematic shows the impurity levels before contact and the resulting space charge and potential after contact; there is no externally extractable equilibrium battery voltage from the built-in field alone.

A forward bias, with p positive relative to n, reduces the barrier from $V_{\mathrm{bi}}$ towards $V_{\mathrm{bi}}-V$ and injects minority carriers across the junction. In the ideal low-injection, diffusion-controlled regime this produces the Shockley diode equation, $I=I_s[e^{eV/(k_{B}T)}-1]$. Reverse bias increases the barrier and the depletion region; only a small thermally generated minority-carrier current flows before breakdown. Reverse-biased depletion regions also give a voltage-dependent junction capacitance. Real devices have recombination, leakage, series resistance and breakdown mechanisms beyond the ideal law. Controlled doping creates majority and minority carriers, and their junction produces a depletion barrier that makes rectification possible.

Take an abrupt equilibrium p-n junction with the p side at $x<0$ and the n side at $x>0$. In the quasi-neutral bulk, electron holes are the majority carriers on the p side and electrons are the majority carriers on the n side. With ionized dopant densities $N_A,N_D$ and nondegenerate statistics,where $n_i$ is the intrinsic carrier concentration. The semiconductor mass-action law $np=n_i^2$ applies at equilibrium. Both mobile populations are small in the depletion region compared with the dopant densities.

The charge and carrier density of an abrupt p-n junction must distinguish mobile populations from net charge. Diffusion leaves negatively charged ionized acceptor impurities on the p side and positively charged ionized donor impurities on the n side. Under the depletion approximation,The neutral bulks have large carrier densities but nearly zero net charge density. The electric field points from the positive donor region toward the negative acceptor region, balancing diffusion at equilibrium.

The figure uses equal dopant densities only to show a simple symmetric sketch. Generally the more lightly doped side has the wider depleted interval. The carrier profiles are smooth, whereas the step-shaped net charge density is the ideal depletion approximation.

Semiconductor doping introduces controlled impurities to alter equilibrium carrier populations and electrical conductivity. In an intrinsic semiconductor, thermally excited electrons in the conduction band and electron holes in the valence band have equal densities $n=p=n_i$. A shallow donor impurity, such as phosphorus in silicon, supplies an electron from an impurity level just below the conduction-band edge. Once ionized it is positively charged, and the material is n type. An acceptor impurity, such as boron in silicon, accepts a valence electron into a level just above the valence-band edge, leaving a mobile hole and a negatively charged ionized impurity; the material is p type.

With dopant densities $N_D,N_A$, charge neutrality requiresFor fully ionized, nondegenerate dopants at equilibrium, the semiconductor mass-action law gives $np=n_i^2$. In a substantially n-type sample, $N_D-N_A\gg n_i$, soThe corresponding p-type result is $p\simeq N_A-N_D$ and $n\simeq n_i^2/(N_A-N_D)$. The majority population grows while the minority population decreases; adding donors does not simply add equal numbers of free electrons and holes.

The Fermi energy shifts toward the conduction band for n-type material and toward the valence band for p-type material. In the nondegenerate approximation,where $N_C,N_V$ are effective band-edge state densities. At very low temperature, dopants may not be ionized and carrier freeze-out occurs. At intermediate temperatures, ionized dopants dominate the carrier density; at sufficiently high temperature, intrinsic excitation can dominate. Heavy doping can produce degenerate carrier statistics, invalidating these Boltzmann expressions.

The electrical conductivity is $\boxed{\sigma =e(n{\mu }_e+p{\mu }_h)}$. Doping usually raises the majority carrier density, but ionized impurity scattering can lower mobility, so conductivity need not scale indefinitely with dopant concentration. Joining p-type and n-type regions creates a p-n junction, with a depletion region and built-in electric field established by carrier diffusion and compensating drift. The fixed ionized dopants, not an absence of all charge, account for the depleted region's net charge density.

Take a p-n junction made from one semiconductor, with the p-type semiconductor on the left and the n-type semiconductor on the right. At thermal equilibrium the chemical potential $\mu =E_F$ is horizontal throughout. Before contact the chemical potential lies nearer the valence band on the p side and nearer the conduction band on the n side; after contact the band edges bend to permit one common value.

In this orientation both the conduction band edge $E_C$ and the valence band edge $E_V$ decrease from p to n by $e{V}_{\mathrm{bi}}$. For a homojunction their separation $E_g=E_C-E_V$ is constant. The acceptor impurity level $E_A$ lies just above $E_V$ where acceptors are present, and the donor impurity level $E_D$ lies just below $E_C$ where donors are present. These impurity levels follow the local band bending; they do not form one additional horizontal band across the device.

The shaded depletion region has few mobile electrons or electron holes and contains fixed negative ionized acceptor impurities on the p side and positive ionized donor impurities on the n side. Thus its electric field points from n to p. Its neutral outer regions have negligible electric field, so the band edges become flat there. In the depletion approximation, charge neutrality requires $N_A{x}_p=N_D{x}_n$; the symmetric drawing illustrates $N_A=N_D$ rather than assuming that equality is universal. Diffusion and field-driven drift current cancel at equilibrium: no applied voltage does not mean zero internal electric field or zero built-in electric potential difference.