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A double heterostructure sandwiches one semiconductor between two layers of another, for example gallium arsenide between aluminium gallium arsenide layers. Suitable band offsets confine injected charge carriers centrally.^[ref]

A two-dimensional electron gas supplied by remote donors in aluminium gallium arsenide and confined on the gallium arsenide side of a heterojunction. An undoped spacer separates ionized donors from mobile carriers, reducing impurity scattering. A conduction-band band offset and self-consistent band bending create the confinement well.

A common implementation uses a gallium arsenide/aluminium gallium arsenide heterostructure with a two-dimensional electron gas near the interface. electrons supplied by remote donors occupy quantized normal-direction states, while an undoped spacer reduces ionized-impurity scattering. Surface metallic gates, insulated from the conducting layer, deplete selected regions when negatively biased.

Leave a small conducting island bounded by depleted regions and connect it weakly to source and drain reservoirs through two tunable constrictions. A plunger gate controls the island potential/population; barrier gates control tunnel coupling. Ohmic contacts connect the reservoirs to the measurement circuit. Vertical heterostructure confinement plus lateral depletion force defines the dot. A 2DEG without lateral gates would remain extended in its plane.

The original device diagram labels the gates, island, tunnel barriers and reservoirs. Charge stability and spectroscopy versus gate/bias should verify that an isolated weakly coupled island has actually formed; a lithographic outline alone is insufficient.

One workable route uses two resist coatings and a metal-defined optical aperture. The following are eleven fabrication operations; exposure/development is grouped as one lithographic operation, and rear metallization includes its contact activation if required. Detailed cleaning, rinsing and inspection occur between compatible operations.

1. Spin-coat a first photoresist on the front surface to define a mesa mask.
2. Expose and develop that mask, retaining resist over the complete active-cell mesa, including its future front contacts.
3. Etch the exposed semiconductor through the p-type layers and slightly into the n-type base. This removes the unwanted junction around the cell and produces the lateral mesa step.
4. Strip the first photoresist, leaving a clean mesa with its cap intact.
5. Spin-coat a second photoresist suitable for the lift-off process.
6. Expose and develop openings at the intended front grid or contact pads, positioned safely inside the mesa edge.
7. Evaporate a p-contact metal stack onto the exposed gallium arsenide and resist. Au/Zn-based contact metallization is a conventional candidate, subject to doping and contact-resistance qualification.
8. Dissolve the second photoresist to lift off unwanted metal, leaving the front contacts on the cap.
9. Selectively remove the cap from the light-receiving aperture, using the front metal as a hard mask and the aluminium gallium arsenide window as the etch stop.
10. Deposit the rear n-contact metallization, for example a qualified AuGe/Ni/Au system, with an appropriate contact-activation anneal if required and compatible with the front contact.
11. Deposit an antireflection dielectric over the optical aperture through a mechanical shadow mask that keeps the contact pads accessible. Its refractive index and thickness are chosen for the target optical band.

The essential material changes are junction isolation at the mesa edge, metal retained on the front cap, cap removed only from the optical aperture, and a conducting rear contact. The metal systems and anneal are a process design, not compositions specified by the drawing. A workable design must also qualify the passivation of etched sidewalls and the front-contact surface preparation.

Use optical photolithography for the two masks and a resist profile compatible with the selected process. A controlled wet mesa etch or a calibrated reactive-ion etching process must pass completely through the p–n interface, with limited sidewall damage. Use profilometry or cross-section controls to verify depth and a test device to check leakage. For the front lift-off process, directional evaporation and an undercut resist profile discourage a continuous metal fence bridging the mask sidewall.

The cap-removal step requires a separately qualified selective etchant: its selectivity between gallium arsenide and the particular aluminium gallium arsenide alloy depends on alloy composition, chemistry and processing conditions. Establish etch rate and endpoint on a witness stack; a universal etch time cannot be inferred from a diagram without thicknesses. The front metal must resist that etchant. Back metallization and activation must establish an ohmic contact rather than an unintended rectifying junction. Verify specific contact resistance on test structures and avoid an anneal that degrades the p–n profile. The final dielectric can be deposited by a low-damage evaporation or other compatible thin-film method.

From the illuminated side downward, the p-type gallium arsenide cap provides a low-resistance route to the front metal contact. It should remain beneath the contact grid but be removed from the optical aperture to reduce parasitic absorption. The wider-band gap p-type aluminium gallium arsenide window transmits much of the useful light and reduces front-surface recombination of carriers in the adjacent absorber. The optical-window and reduced-recombination rationale has a primary experimental basis in early heteroface devices.^[ref]

The p-type gallium arsenide emitter and n-type gallium arsenide base form the p-n junction. Absorbed photons generate electrons and electron holes; diffusion and the junction's electric field direct them toward the appropriate contacts. The n-type aluminium gallium arsenide back-surface-field layer provides a barrier to minority holes moving toward the substrate and reduces rear recombination. The n-type gallium arsenide substrate supports the epitaxial layers and conducts majority carriers to the rear contact.

The front metal must collect current with limited shading and the back metal provides the return contact. Interpreting the patterned hatched region as the optical antireflection coating, it reduces reflected light over the exposed window. Carrier selectivity, low recombination, low series resistance and low shading must work together; the equilibrium junction field alone is not a source of electrical energy.

A gallium arsenide/aluminium gallium arsenide semiconductor heterostructure combines lower-gap GaAs with a higher-gap AlGaAs barrier. In a modulation-doped design, AlGaAs donors supply electrons to lower conduction-band states on the GaAs side. An undoped spacer separates the channel from ionized donors and reduces impurity scattering. The interface barrier and band bending quantize motion normal to the interface while allowing in-plane motion: a two-dimensional electron gas.

The normal confining potential is commonly triangular and finite rather than an infinite square well. At suitable density and low temperature, only the lowest normal subband is occupied. modulation doping reduces an important scattering source; it does not eliminate all disorder.

Use negatively biased surface gates to deplete the surrounding electron gas and leave a rectangular central region. Gate voltage controls lateral dimensions and barrier heights. Two constrictions can weakly couple the region to reservoirs, with a plunger gate controlling population. Etched boundaries are possible but may introduce edge disorder. A flat interior and steep edges approximate a box, givingFringing fields, finite barriers and penetration change the ideal result. A 2DEG confines only the normal direction; gates supply the extra lateral confinement. Gate-dependent spectroscopy can test level spacings, while charging measurements separate orbital confinement from Coulomb blockade.

A gallium arsenide/aluminium gallium arsenide heterojunction has a conduction-band offset that can confine electrons on the GaAs side. Donors in the wider-gap AlGaAs supply electrons; band bending produces a narrow interfacial potential well. Motion normal to the interface is quantized into subbands, while motion within the plane remains approximately free with GaAs effective mass. Occupying the lowest confinement subband creates a two-dimensional electron gas.

Modulation doping spatially separates the ionized donors from the mobile electrons. An undoped spacer between the donor layer and the channel reduces Coulomb scattering from donor ions while still allowing charge transfer. This can produce higher mobility than doping the conducting channel itself. The spacer thickness balances lower scattering against weaker carrier supply and electrostatic control; interface roughness, alloy disorder, phonons and background impurities can still limit mobility. The channel is a finite-width quantum wavefunction, not a mathematically zero-thickness sheet.

A high-mobility modulation-doped GaAs-AlGaAs electron gas is grown by molecular beam epitaxy as a clean layered semiconductor heterostructure. An undoped gallium arsenide region is followed by an undoped aluminium gallium arsenide spacer and a donor-doped barrier region, commonly with a protective cap. The closely matched crystal structures allow a high-quality heterojunction. The spacer supplies a crucial separation: the mobile electrons reside away from the ionized donors, reducing impurity scattering compared with putting the donors directly in the conducting layer.

The larger conduction band energy on the aluminium gallium arsenide side permits donor electrons to transfer into gallium arsenide. The resulting charge separation creates band bending; together with the band offset, it forms a roughly triangular quantum well at the interface. The normal-direction wavefunction is confined, while motion parallel to the interface remains approximately free:When only the lowest confinement subband is occupied, this is a two-dimensional electron gas. It is the quantized normal motion, not a physically zero layer thickness, that makes the low-energy system two-dimensional.

At zero magnetic field, one occupied spin-degenerate parabolic subband has constant density of states per area per energy, $D_0=m^{\ast }/(\pi {\hslash }^2)$ above its edge. A perpendicular field quantizes the in-plane orbital motion into Landau levels:Here $g^{\ast }$ is the material's effective spin factor and $e$ is the positive elementary charge; no free-electron $g=2$ assumption is made for this semiconductor. Each resolved spin branch contains $e|B|/h$ states per unit area. The ideal density of states becomeswith Landau-level broadening in a real sample. The Landau filling factorcounts the carrier density in units of one spin-resolved level's degeneracy. Two unresolved spin branches have twice that degeneracy; resolved branches must not each be counted twice.

Disorder localizes states in the broadened level tails, while extended states occur near level centres. As $B$ varies, occupation of localized states can change without changing the number of current-carrying edge channels. This produces a finite-width quantum Hall plateau, rather than quantization only at isolated fields. In a mobility gap, longitudinal resistivity approaches zero and the Hall magnitude is $R_K/N=h/(N{e}^2)$ for $N$ occupied transmitting branches. When the chemical potential passes through extended states, longitudinal dissipation peaks and the Hall value changes to another plateau. A spectral density of states can remain nonzero where transport is localized. Very strong disorder can destroy the resolved quantum Hall regime; the statement is not that any amount of disorder improves it.

The original plot is schematic, not fitted data. At fixed sheet density, increasing $|B|$ decreases Landau filling factor, so the Hall magnitude climbs through $R_K/N$ plateaus while longitudinal peaks separate the plateaus. The signed Hall voltage depends on carrier and probe conventions.

For the gate calculation, the target sheet density is fixed by the desired Landau filling factor:Use top-gate density tuning in the parallel-plate approximation. The geometric capacitance per unit area isThereforeThe gate must become more negative relative to the electron gas, reducing its density. The voltage is the change from the gate setting associated with the stated initial density; if that setting is defined as zero, it is the required gate voltage. Work-function offsets, trapped charge and quantum capacitance are neglected. An absolute voltage referenced to some other uncalibrated potential cannot be inferred from geometry alone. Numerical values use exact SI $h=6.62607015\times 10^{-34}\mathrm{J}\mathrm{s}$ and $e=1.602176634\times 10^{-19}\mathrm{C}$, and ${ϵ}_0\simeq 8.8541878188\times 10^{-12}\mathrm{F}{\mathrm{m}}^{-1}$.^[ref]

For the subsequently specified five-channel plateau, the chemical potential between the fifth and sixth resolved branches means $N=5$, not ten. The physical contact order in the PDF is $1,2,3,4$ along one side of the mesa. Use ideal equilibrating Ohmic contacts and the Landauer-Büttiker formula, rather than inferring a longitudinal measurement merely from the contacts being drawn on one edge.

Choose one field polarity so the chiral order is $1\to 2\to 3\to 4\to 1$. With $G_H=5e^2/h$,Contacts 2 and 4 are voltage probes, so $I_2=I_4=0$. With $V_3=0$, this gives $V_2=V_1$, $V_4=V_3=0$, and $I_1=G_H{V}_1$. Hencefor this circulation. Reversing the field reverses the contact order and gives $R_{13,24}=-h/(5e^2)$ with the same voltage ordering. The resistance magnitude is $5.16\mathrm{k\Omega }$; it is not zero. Contact 2 samples the outgoing source potential and contact 4 the outgoing drain potential for the chosen chirality.

The antidot is a depleted island supporting closed quantum Hall edge states. Tunnelling between those states and opposite propagating edges can produce resonant backscattering and resistance peaks as $B$ varies. One electronic Aharonov-Bohm phase winds by $2\pi$ when flux through a fixed effective orbit area $S$ changes by $h/e$. Using the supplied area as that effective area,With the two spin-split branches of the lowest orbital level occupied, the common Coulomb-dominated antidot oscillation model has two charge rearrangements per added $h/e$ flux. Both branches contribute to charge buildup; screening and their capacitive coupling can make tunnelling through the outer edge occur twice during the cycle. It then givesThis is two electron-tunnelling resonances per flux cycle, not evidence that the mobile particles have charge $2e$. The primary charging model specifically addresses this two-spin regime.^[ref]

The sketch shows resistance peaks in a weak-backscattering configuration, with arbitrary height and linewidth because tunnel couplings and temperature are unspecified. A two-spin count alone does not force two independent noninteracting resonance series to be exactly half a flux period apart: their relative positions also depend on spin splitting and confinement. Thus $51.7\mathrm{mT}$ describes the stated charging-model interpretation; $103.4\mathrm{mT}$ is the single-electron fixed-area flux period. The actual enclosed edge-orbit area can differ from the geometrically depleted area.

For bulk filling two and total forward transmission $\mathcal{T}$ in spin-resolved units, ideal chiral probes give the longitudinal four-terminal resistanceResonant loss of transmission therefore gives peaks. Their size, background and detailed shape cannot be calculated from the supplied area and bulk filling alone. If the gates instead make a tunnelling path that enhances forward transmission, the resonant contrast can be reversed; the plotted peak convention is explicitly the backscattering one.

Daniel Tsui, Horst Störmer and Arthur Gossard reported the effect in 1982. They grew gallium arsenide–aluminium gallium arsenide layers by molecular beam epitaxy, separating the two-dimensional electron gas from its semiconductor doping. They cut Hall bars and made indium contacts. Low-field measurements established number density and charge carrier mobility. A perpendicular magnetic field sweep measured transverse and longitudinal sheet resistivities at several temperatures. Cooling sharpened the plateau near $3h/e^2$ and the longitudinal minimum at filling factor $1/3$; integer plateaus provided an internal comparison. The longitudinal minimum remained finite at the lowest temperature: zero-temperature vanishing was unresolved. This established anomalous transport, without directly measuring excitation electric charge.^[ref]

The two readouts test different statements. A single intersection with $R_H=3R_K$ would also occur on the smooth classical relation $R_H=B/(n_{s}e)$ at $n_{s}h/(eB)=1/3$. A quantum Hall plateau instead persists over a magnetic field interval. Comparing transverse and longitudinal signals helps distinguish that plateau from a contact-placement artefact; the quantum Hall conductivity tensor inversion quantifies the contamination when longitudinal sheet resistivity is nonzero.

Later, 1997 shot noise measurements associated with quantum tunnelling at filling factor $1/3$ tested the excitation electric charge separately, finding $e/3$. That is a different observable from a Hall plateau.^[ref]