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For fixed band effective masses and band gap $E_g$, the intrinsic carrier concentration obeys $n_i=C{T}^{3/2}{e}^{-E_g/(2k_{B}T)}$. ThusA base-ten plot against $x=1000\mathrm{K}/T$ instead has slope $-E_g/(2000k_B\mathrm{K}\ln 10)$ after the prefactor correction. The intrinsic branch must be used, rather than the extrinsic plateau or dopant freeze-out branch. A changing gap or effective mass makes this an activation-energy estimate, and a small gap uncertainty can produce a much larger multiplicative uncertainty in a room-temperature minority density.

For a nondegenerate semiconductor with donor density $N_D$, no acceptors, and donor energy $E_D=E_c-E_b$, an occupied donor has two electron spin states while an empty donor has one. Its ionized fraction is therefore $N_D^{+}/N_D=[1+2e^{(E_F-E_D)/(k_{B}T)}{]}^{-1}$. The conduction-band relation $n=N_c{e}^{(E_F-E_c)/(k_{B}T)}$ gives $N_D^{+}=N_D/[1+(2n/N_c)e^{E_b/(k_{B}T)}]$. Combining charge neutrality, $n-p=N_D^{+}$, with the semiconductor mass-action law, $np=n_i^2$, proves the displayed equation.

Its left side increases strictly for $n>0$ and its right side decreases, so there is one physical solution, with $n\ge n_i$. In the freeze-out regime, holes are negligible and solving the quadratic gives $n=2N_D/[1+\sqrt{1+(8N_D/N_c)e^{E_b/(k_{B}T)}}]$. Strong dopant freeze-out reduces this to $n\simeq \sqrt{N_D{N}_c/2}{e}^{-E_b/(2k_{B}T)}$. An extrinsic plateau requires $(2N_D/N_c)e^{E_b/(k_{B}T)}\ll 1$ and $n_i\ll N_D$, not simply $k_{B}T\gg E_b$.

At sufficiently low temperature, donor or acceptor ionization becomes energetically unfavourable. Carriers remain bound to dopants rather than contributing to conduction, reducing the mobile carrier density. This dopant freeze-out is distinct from the high-temperature intrinsic regime, where thermal excitation across the band gap overwhelms the net dopant contribution.

There are three useful temperature regimes.

At low temperature, dopant freeze-out keeps most donor electrons bound. Warming ionizes donors and increases conductivity through the rising mobile-electron concentration. For an uncompensated dilute donor system, negligible holes and spin degeneracy two, charge neutrality with partial donor ionization givesDeep in freeze-out, $n\ll N_D$, soThe activation scale is set by the shallow donor binding, rather than the whole band gap.

In the extrinsic regime, donors are largely ionized and $n\simeq N_D$ is nearly constant. The temperature dependence of conductivity then mainly follows the electron mobility. Increasing phonon scattering can make conductivity fall as temperature rises, even though donors remain ionized; impurity scattering can give a different mobility trend at lower temperature.

At sufficiently high temperature, thermally generated electron–hole pairs overwhelm the dopant population. The intrinsic, gap-activated increase in conductivity returns. The boundaries depend on donor concentration, compensation and scattering, so no one exponential describes the entire doped-sample curve.

Arsenic has five valence electrons, whereas silicon has four. A substitutional arsenic atom can therefore supply an extra electron after participating in the silicon bonding network. It acts as a shallow donor impurity, introducing a localized level $E_D$ just below the conduction band. Ionizing that donor costs much less energy than excitation across the full band gap.

At the lowest temperatures, donor electrons remain bound and the valence band is filled. Mobile-carrier populations are negligible: this is dopant freeze-out. Initial heating releases donor electrons into the conduction band, producing a rapid rise in conductivity governed by the shallow-donor energy scale. The positive ionized donor charge compensates the released electronic charge; the bulk need not acquire net charge.

At intermediate temperatures, nearly all donors are ionized but intrinsic electron–hole generation is still small. In an uncompensated sample,where $N_D$ is donor number density. The supply of donor electrons is finite, so further heating cannot keep creating them. This is the extrinsic plateau under the approximation of weakly varying mobility, and its carrier density is much larger than that of the undoped sample at the same temperature. In real material, scattering changes mobility, so donor exhaustion alone predicts a carrier-density plateau rather than guaranteeing perfectly flat conductivity.

At higher temperatures, intrinsic generation becomes comparable to and then exceeds the donor contribution. Once $n_i\gg N_D$, the populations approach $n\simeq p\simeq n_i$, and activation across the main gap causes the steeper rise. The relevant regimes are therefore freeze-out, donor exhaustion, and intrinsic excitation, not three successive types of dopant.

An intrinsic semiconductor has thermally generated conduction electrons and valence holes, with $n=p=n_i$ at equilibrium in the ideal undoped neutral material. Their abundance is controlled by its band gap, temperature and band density of states.

An extrinsic semiconductor has its mobile carrier populations substantially modified by electrically active impurities. A donor impurity can supply electrons, producing n-type material; an acceptor impurity can capture a valence electron and leave a mobile electron hole, producing p-type material. Compensation and incomplete ionization can modify these simple counts. At low temperature dopant freeze-out can occur; at sufficiently high temperature intrinsic pair production can overwhelm a fixed dopant density. Doping and the dominant transport regime are related but are not interchangeable descriptions at every temperature.

Doping changes the mobile carrier population by introducing controlled impurity levels. In an intrinsic semiconductor, the filled valence band is separated from the nearly empty conduction band by a band gap $E_g$. Thermal excitation produces an electron-hole pair, so the electron and hole number densities obey $n=p=n_i$. A electron hole represents a missing valence-band electron and behaves as a mobile positive charge carrier. For nondegenerate bands in thermal equilibrium,Here $N_C,N_V$ are the effective density of states, $E_C,E_V$ the band edges, and $E_F$ denotes the chemical potential, conventionally called the Fermi level. The semiconductor mass-action law holds in this nondegenerate equilibrium regime.

In a tetrahedrally bonded elemental semiconductor such as silicon, a substitutional group-V atom has an extra outer electron relative to the host. It is a donor impurity: a shallow level just below $E_C$ can ionise, releasing an electron to the conduction band and leaving a fixed positively charged donor. The resulting n-type semiconductor has electrons as majority carriers and holes as minority carriers. Conversely a group-III substitution supplies one fewer bonding electron. An acceptor impurity can take an electron from the valence band, leaving a mobile electron hole and a fixed negative acceptor; the resulting p-type semiconductor has holes as majority carriers.

The impurity state is shallow because the electron or hole responds to a screened Coulomb potential and an effective mass, rather than the bare atomic potential. A simple hydrogenic donor estimate iswhere ${ϵ}_r$ is the relative permittivity. This is a useful scaling model, with real band anisotropy and central-cell effects omitted. Dopants are fixed in the lattice; their ionisation changes mobile carrier numbers without making a uniformly doped bulk sample carry a large net electric charge.

The charge neutrality condition isWhen shallow dopants are almost fully ionised and $N_D-N_A\gg n_i$, an n-type region has $n\simeq N_D-N_A$ and $p\simeq n_i^2/n$. A p-type region similarly has $p\simeq N_A-N_D$ and $n\simeq n_i^2/p$. Thus compensation by the opposite impurity type reduces the majority-carrier density; the total dopant concentration is not generally the mobile carrier density. At sufficiently high impurity density the degenerate semiconductor regime requires the full Fermi-Dirac distribution and these exponential approximations fail.

There are three useful temperature regimes. At low temperature, dopant freeze-out leaves many shallow levels un-ionised. In the extrinsic regime, the dopants are largely ionised and set the majority-carrier density. At high enough temperature, intrinsic pair creation dominates and $n,p$ approach $n_i$. The Fermi level moves towards the conduction band with donor doping and towards the valence band with acceptor doping. The electrical conductivity isDoping therefore controls conductivity and its carrier type, but ionised impurities also scatter carriers and can reduce charge carrier mobility. Carrier density and mobility must both be considered.

A p-n junction forms when p-type and n-type regions are joined within a semiconductor. Initially the concentration gradients drive diffusion current: electrons diffuse from the n region to the p region and holes in the opposite direction. Recombination removes mobile majority carriers near the join, exposing fixed positive donors on the n side and fixed negative acceptors on the p side. This forms a depletion region and an electric field directed from n to p. Its drift current opposes diffusion. At equilibrium the net current vanishes and the Fermi level is uniform, although the band edges vary spatially through band bending.

For an abrupt nondegenerate junction with fully ionised dopants, its built-in potential isUnder the depletion approximation, the space-charge densities are $-e{N}_A$ on a p-side width $w_p$ and $+e{N}_D$ on an n-side width $w_n$. Integrating Poisson equation and imposing zero field outside gives $N_A{w}_p=N_D{w}_n$ andMost of the depletion width therefore extends into the more lightly doped side. The schematic shows the impurity levels before contact and the resulting space charge and potential after contact; there is no externally extractable equilibrium battery voltage from the built-in field alone.

A forward bias, with p positive relative to n, reduces the barrier from $V_{\mathrm{bi}}$ towards $V_{\mathrm{bi}}-V$ and injects minority carriers across the junction. In the ideal low-injection, diffusion-controlled regime this produces the Shockley diode equation, $I=I_s[e^{eV/(k_{B}T)}-1]$. Reverse bias increases the barrier and the depletion region; only a small thermally generated minority-carrier current flows before breakdown. Reverse-biased depletion regions also give a voltage-dependent junction capacitance. Real devices have recombination, leakage, series resistance and breakdown mechanisms beyond the ideal law. Controlled doping creates majority and minority carriers, and their junction produces a depletion barrier that makes rectification possible.

Semiconductor doping introduces electrically active impurities. In gallium arsenide, silicon has one more valence electron than gallium but one fewer than arsenic. Silicon on a gallium site can therefore supply a shallow donor electron, while silicon on an arsenic site can accept an electron and leave a mobile hole. It is an amphoteric dopant, so its net effect depends on site occupation and growth conditions.^[ref]

For isotropic parabolic bands, shift the energy origin in the given free-electron density of states to the appropriate band edge and use its effective mass:and, for valence electron states,The stated normalization includes the two spin states and assumes one effective valley. In a nondegenerate semiconductor, the conduction occupation is approximately $e^{-(E-\mu )/(k_{B}T)}$ and the probability of a valence hole is approximately $e^{(E-\mu )/(k_{B}T)}$. Substituting $x=(E-{ϵ}_c)/(k_{B}T)$ in the first integral, and the corresponding hole energy in the second, giveswhere the effective density of states values are $N_c=2[m_e{k}_{B}T/(2\pi {\hslash }^2){]}^{3/2}$ and $N_v=2[m_h{k}_{B}T/(2\pi {\hslash }^2){]}^{3/2}$. The factor $\sqrt{\pi }/2$ comes from the supplied Gaussian-weighted integral. Multiplying cancels the shared thermodynamic equilibrium chemical potential and proves the semiconductor mass-action law:For the given sample $N_D=2\times 10^{21}{\mathrm{m}}^{-3}$ and $N_A=10^{21}{\mathrm{m}}^{-3}$. With complete donor ionization and occupied acceptors, charge neutrality gives $n-p=N_D-N_A=10^{21}{\mathrm{m}}^{-3}$. At $293\mathrm{K}$ the given masses and gap giveSolving the compensated semiconductor equations, or using $n_i\ll N_D-N_A$, yieldsThe very small minority density is consistent with the wide gap and the strongly n-type balance. Also $n/N_c\simeq 2.6\times 10^{-3}\ll 1$ and $p/N_v\ll 1$, checking the nondegenerate approximation. The acceptor levels are occupied in this n-type regime; complete acceptor ionization in the compensation equation is appropriate to the model.

At low temperature dopant freeze-out reduces the conduction-electron population; a quantitative curve would require dopant binding energies and occupation factors. Once donors are ionized while intrinsic excitation is negligible, $n\simeq N_D-N_A$ gives an extrinsic plateau. At higher temperature intrinsic pairs eventually dominate, so $n\simeq p\simeq n_i(T)\propto T^{3/2}{e}^{-E_g/(2k_{B}T)}$ if the gap and masses are treated as constant. Real gap and mass changes modify that last expression.

An intrinsic semiconductor has negligible electrically active impurity doping, and thermal excitation across its band gap produces equal electron and hole densities $n=p=n_i$. In an extrinsic sample, semiconductor doping supplies donor impurities or acceptor impurities, so one carrier species dominates over a range of temperatures. Doping does not remove the possibility of low-temperature dopant freeze-out or high-temperature intrinsic behavior.

Assume parabolic isotropic band edges, spin degeneracy two, a single valley, thermal equilibrium and nondegenerate carriers. Write $E_F$ for the Fermi level, and measure conduction-band energy by $E=E_c+ϵ$. Counting momentum states gives the density of states per unit volumeThe low-occupation Maxwell–Boltzmann statistics givesThe substitution $x=ϵ/(k_{B}T)$ and ${\int }_0^{\infty }\sqrt{x}{e}^{-x}dx=\sqrt{\pi }/2$ give the coefficient. Similarly $p=N_v{e}^{(E_v-E_F)/(k_{B}T)}$ and $N_v=2[m_h^{\ast }{k}_{B}T/(2\pi {\hslash }^2){]}^{3/2}$. Multiplication eliminates $E_F$, proving the semiconductor mass-action lawHere the supplied effective masses are treated as the masses entering the effective density of states. A detailed multivalley silicon model would require the appropriate valley degeneracy and density-of-states masses consistently; adding an extra factor without changing the stated model would alter the requested expression.

A pentavalent arsenic impurity supplies a weakly bound excess electron. In the hydrogenic donor state approximation, dielectric screening reduces the Coulomb attraction and the band effective mass replaces the free mass. Hence the donor binding energy isThis is the effective-mass estimate, without a material-specific central-cell correction.

For the temperature plot use donor density $N_D=10^{15}{\mathrm{cm}}^{-3}$ and no acceptors. The charge neutrality with partial donor ionization model puts $E_D=E_c-E_b$ and includes the twofold spin degeneracy of an occupied donor:These equations give three regimes. At low temperature, $p$ is negligible and strong dopant freeze-out gives $n\simeq \sqrt{N_D{N}_c/2}{e}^{-E_b/(2k_{B}T)}$. At intermediate temperature, the donors are almost ionized and intrinsic holes remain rare, so $n\simeq N_D$. At high temperature, $n\simeq p\simeq n_i\propto T^{3/2}{e}^{-E_g/(2k_{B}T)}$. Thus the log-density plot against inverse temperature has a steep intrinsic segment on the left, a nearly horizontal extrinsic plateau, and a freeze-out decline on the right; the $T^{3/2}$ and $T^{3/4}$ factors give slight curvature.

To quantify “approximately constant”, require $0.9N_D\le n\le 1.1N_D$. At $300\mathrm{K}$, the specified model gives $N_c\simeq 4.12\times 10^{18}$, $N_v\simeq 8.61\times 10^{18}$ and $n_i\simeq 2.33\times 10^9{\mathrm{cm}}^{-3}$. The full neutrality equations give the ten-percent plateau intervalThe lower boundary is set by donor ionization and the upper boundary by intrinsic electron-hole production. The large ratio $N_c/N_D$ allows substantial donor ionization even when $k_{B}T<E_b$; using only $k_{B}T\gg E_b$ would incorrectly exclude much of the plateau. The quoted interval depends on the chosen tolerance and the constant-gap band model, rather than being an exact measured range for arsenic-doped silicon.

Dopant atoms and carrier type. Substitutional semiconductor doping places a small fraction of foreign atoms on host lattice sites. In a tetrahedrally bonded group-IV semiconductor, a group-V substitution such as phosphorus in silicon has an extra valence electron. A shallow donor level just below the conduction edge can release that electron, leaving a positively charged donor. In an n-type semiconductor, mobile electrons are the majority carriers and the chemical potential shifts toward the conduction band.

A group-III substitution such as boron in silicon has one fewer valence electron. An acceptor level just above the valence edge captures an electron from the valence states, leaving a mobile electron hole and a negatively charged acceptor. In a p-type semiconductor, electron holes are the majority carriers and the chemical potential shifts toward the valence band. The material can remain electrically neutral in both cases: mobile carrier electric charge is compensated by fixed ionized impurity electric charge. Dopant freeze-out, compensation and degeneracy qualify the simplest one-carrier-per-dopant picture.

Making the junction. Choose p material at $x<0$ and n material at $x>0$. Electrons initially diffuse from n to p, and electron holes from p to n, recombining near the interface. Negative ionized acceptors are exposed on the p side and positive ionized donors on the n side. They produce an electric field directed from n to p. The field opposes further majority-carrier diffusion until drift and diffusion balance and the equilibrium electrochemical potential is uniform.

The depletion regions are depleted of mobile majority carriers, not of the fixed dopant charges that create the space charge. At equilibrium the conduction and valence edges bend together, while the chemical potential is flat. The specified $\Delta {\varphi }_0$ is a electric potential difference: the corresponding initial chemical-potential energy separation is $e\Delta {\varphi }_0$. This convention is required by the quoted units and width formulas. Write ${\epsilon }_s=ϵ{ϵ}_0$ for the absolute permittivity; the paper's $ϵ$ is relative permittivity.

Poisson equation and widths. Let the depleted intervals be $-w_p<x<0$ and $0<x<w_n$. Fully ionized number densities $N_A,N_D$ correspond to electric charge densities $-e{N}_A,+e{N}_D$, respectively. ThusThe factor $e$ converts a dopant concentration to a space-charge density. Requiring zero field in both neutral regions gives charge neutrality,With $\mathcal{E}=-{\varphi }^{\prime }$, direct integration gives the triangular fieldContinuity at the interface is the same neutrality condition. The field is negative throughout the depleted interval. Set $\varphi (-w_p)=0$. Its integral givesPotential continuity therefore requiresCombining it with neutrality yields the abrupt-junction depletion width and capacitance resultsThe more lightly doped side depletes farther, because equal and opposite space charges must be exposed.

Applied bias. Define positive $V$ as forward bias, raising the p-side terminal potential relative to the n-side terminal. It lowers the remaining barrier from $\Delta {\varphi }_0$ to $\Delta {\varphi }_0-V$. Reverse bias has $V<0$ and raises that barrier. The same Poisson integration applies, with this replacement:Forward bias narrows the depleted region; reverse bias widens it. Under bias there need not be one equilibrium chemical potential across the device, so the equilibrium flat-level argument must not be reapplied unchanged. The barrier/width change is illustrated in the next figure.

Differential capacitance and electric charge sign. Put $B=\Delta {\varphi }_0-V>0$ and $N_{\mathrm{eff}}=N_A{N}_D/(N_A+N_D)$. The signed p-side fixed electric charge per unit area isDifferentiating with respect to forward electric potential difference gives the positive capacitance per unit areaThe n-side electric charge is $Q_n=-Q_p$, so $d{Q}_n/dV=-C_A$ instead. If $Q$ denotes a positive space-charge magnitude, the positive capacitance is $-dQ/dV$ for this forward-voltage convention. This resolves the sign implicit in the paper's positive $dQ/dV$. The total device capacitance is $C=\mathcal{A}{C}_A$, where $\mathcal{A}$ is its cross-sectional area.

Finite device and numerical sketch. For the symmetric device, $N_A=N_D=N$ and each side has thickness $d$. Before full depletion,Using ${\epsilon }_s=12{ϵ}_0=1.0625\times 10^{-10}\mathrm{F}{\mathrm{m}}^{-1}$, the zero-bias width on each side is $4.07\mu \mathrm{m}$, less than $d=10\mu \mathrm{m}$. The total zero-bias capacitance is $\boxed{C(0)\simeq 1.30\mathrm{pF}}$.

Full depletion occurs when $w=d$, soAt larger reverse bias the depleted thickness cannot exceed $2d$. In the ideal fully depleted slab, incremental terminal electric charge changes the field uniformly through that fixed thickness, giving the full-depletion capacitance of a symmetric junction slabThus the idealized piecewise sketch over the specified range isIt is continuous at full depletion, rises through $1.30\mathrm{pF}$ at zero bias, and has a formal inverse-square-root divergence as $V\to 0.5\mathrm{V}$ from below.

There are two physical limits to this extension. Once all dopants are exposed, their fixed space charge no longer increases, but the terminal electrodes can still acquire incremental electric charge; differentiating only the fixed ionized electric charge would incorrectly predict zero capacitance. Near $V=\Delta {\varphi }_0$, the depletion approximation itself fails as mobile carriers and forward injection become important, so the formal infinite endpoint is not a prediction of an actual infinite measured capacitance. The fully depleted plateau assumes ideal contacts and no breakdown, injection storage or extra series capacitance.

Band edges and optical transitions. A direct band gap has the conduction minimum and valence maximum at the same crystal momentum. A near-edge photon then connects the two almost vertically on an energy-versus-wavevector plot, because its momentum is small on the Brillouin zone scale. An indirect band gap has the extrema at different momenta, so an additional momentum transfer, commonly supplied by phonon absorption or emission, is required for a near-edge radiative transition. This reduces its probability relative to an allowed direct transition.

Near the zone centre, an isotropic direct-gap model has $E_c(k)=E_c+{\hslash }^2{k}^2/(2m_e^{\ast })$ and downward valence dispersions $E_{v,j}(k)=E_v-{\hslash }^2{k}^2/(2m_{h,j}^{\ast })$. The heavy-hole and light-hole bands are the upper branches with large and small positive hole masses: the heavy branch is flatter. In common cubic semiconductors these arise from the $j=3/2$ manifold, while spin-orbit coupling places the $j=1/2$ split-off valence band lower by ${\Delta }_{\mathrm{so}}$. Its thermally generated hole population is suppressed by approximately $e^{-{\Delta }_{\mathrm{so}}/(k_{B}T)}$ relative to upper-valence holes, apart from density-of-states factors. Neglect is justified when ${\Delta }_{\mathrm{so}}\gg k_{B}T$; it is not a universal exclusion of this band at arbitrary temperature.

For an indirect material such as Si, the conduction minimum need not be at $\Gamma$. In applying the carrier-density formulae, $E_c$ must mean the actual minimum of the included conduction valley. The supplied scalar effective masses and densities of states constitute a simplified band-edge model; they do not specify Si's full valley anisotropy or multiplicity.

Carrier populations. Let $f(E)$ be the Fermi-Dirac distribution. In the nondegenerate conduction tail, $f(E)\simeq e^{-(E-\mu )/(k_{B}T)}$. Set $x=E-E_c$ and integrate the given density of states:The integral is $\Gamma (3/2)(k_{B}T{)}^{3/2}=\sqrt{\pi }(k_{B}T{)}^{3/2}/2$. Defining the effective density of states givesThe factor two is already included in the supplied density of states; it must not be added a second time.

A hole is an unoccupied valence state. For $E$ sufficiently below $\mu$, $1-f(E)\simeq e^{(E-\mu )/(k_{B}T)}$. Substitution of $x=E_v-E$ gives in exactly the same wayTheir product eliminates the chemical potential:This is the semiconductor mass-action law at thermal equilibrium. In an intrinsic semiconductor, charge neutrality additionally givesIn a doped semiconductor the product still applies in this nondegenerate equilibrium model, but the two populations need not be equal.

Intrinsic chemical potential. Taking logarithms of $n=p$ yields the intrinsic-semiconductor chemical potentialFor unequal band degeneracies, use the first form with the full $N_c,N_v$. For the supplied mass ratio $m_h^{\ast }/m_e^{\ast }=1/2$, the shift from midgap at $300\mathrm{K}$ is approximately $-13.4\mathrm{meV}$, toward the valence edge.

Three temperature regimes. The original plot runs from high temperature on the left to low temperature on the right. At high temperature, thermal excitation across the gap dominates and $n\simeq p\simeq n_i$ rises rapidly with temperature. In the middle, donors and acceptors are effectively ionized, the material is extrinsic, and $n\simeq N_D-N_A$ makes the plateau. At low temperature, dopant freeze-out binds increasing numbers of electrons to donor levels, reducing the mobile-electron population as the sample cools. Its activation scale is a donor binding energy, not the full band gap. Compensation and incomplete ionization affect that regime.

Gap estimate from the original figure. On the dashed intrinsic branch, $n_i=C{T}^{3/2}{e}^{-E_g/(2k_{B}T)}$. Hence band-gap extraction from intrinsic carrier activation uses the slope of $\ln (n_i/T^{3/2})$ versus $1/T$. With $x=1000\mathrm{K}/T$ and $k_B$ expressed in eV/K, two points giveThe very compressed intrinsic branch is only approximately readable: $n_i\sim 10^{15}\mathrm{c}{\mathrm{m}}^{-3}$ near $x\sim 1.8$ and $n_i\sim 10^{13}\mathrm{c}{\mathrm{m}}^{-3}$ near $x\sim 2.5$. These give $E_g\sim 1.0\mathrm{eV}$, rather than a precision determination. Neglecting the thermal prefactor gives about $1.13\mathrm{eV}$ from those same rough points. Thus a gap of order $1$–$1.1\mathrm{eV}$ is justified by this schematic plot; its resolution does not support distinguishing a few hundredths of an electronvolt. The declining freeze-out branch must not be used to infer the full gap.

Room-temperature densities. At $300\mathrm{K}$, the supplied masses giveIn the fully ionized extrinsic plateau, put $N=N_D-N_A=10^{15}\mathrm{c}{\mathrm{m}}^{-3}$. Charge neutrality and the mass-action law implySince $n_i\ll N$, $n\simeq 10^{15}\mathrm{c}{\mathrm{m}}^{-3}$ is insensitive to the imprecise gap. The minority density is much more sensitive:Using $E_g=1.0\mathrm{eV}$ gives $n_i\simeq 5.8\times 10^{10}\mathrm{c}{\mathrm{m}}^{-3}$ and $p\simeq 3.3\times 10^6\mathrm{c}{\mathrm{m}}^{-3}$. Using $1.1\mathrm{eV}$ instead gives $n_i\simeq 8.3\times 10^9\mathrm{c}{\mathrm{m}}^{-3}$ and $p\simeq 7.0\times 10^4\mathrm{c}{\mathrm{m}}^{-3}$. These are explicitly conditional estimates within the stated mass model. The plot alone cannot fix a precise minority density because the uncertain gap occurs inside an exponential.

Ordinary doped semiconductor devices need a regime where their donor impurities or acceptor impurities supply mobile charge carriers while intrinsic thermal excitation remains sufficiently small.

At low temperature, donor impurities or acceptor impurities may no longer be ionized. Dopant freeze-out reduces the carrier density, raises electrical resistance and changes the intended carrier injection and p-n junction response. At high temperature the intrinsic carrier concentration grows aswhen band effective masses and band gap are treated as constant. Once it becomes comparable with the net doping density, it overwhelms the intended electron-hole imbalance; reverse leakage and dissipation increase and useful p/n control is lost.

The usual operating window lies between freeze-out and intrinsic conduction, with mobility and thermal management placing further practical limits. This is a statement about conventional doped-device operation, not a fundamental prohibition on engineered cryogenic or wide-bandgap devices.