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A semiconductor whose mobile charge carrier population requires Fermi-Dirac statistics rather than a dilute Maxwell-Boltzmann distribution. In a strongly degenerate n-type semiconductor, the Fermi level lies inside the conduction band; in a strongly degenerate p-type semiconductor, it lies inside the valence band. The occupied and empty quantum states on opposite sides of a tunnel diode can then overlap in energy. Heavy semiconductor doping both changes these occupations and narrows the depletion region; a narrow barrier and accessible final quantum states serve different roles.

Thermal generation of electron-hole pairs within a reverse-biased depletion region can supply a leakage electric current in addition to neutral-region diffusion. For a simple midgap trap with equal electron and hole lifetime parameters, its scale is $e\mathcal{A}W{n}_i/(2{\tau }_g)$, where $W$ is depletion width and ${\tau }_g$ the lifetime parameter. The electric field separates generated carriers. Unlike ideal diode minority-carrier diffusion current, this contribution scales approximately with $n_i$ rather than $n_i^2$ and can vary with reverse voltage through $W$. Consequently a measured activation energy need not equal the full band gap.

The incremental capacitance associated with changes of electric charge around a p-n junction. Its depletion contribution is often estimated by $C_j\simeq {\epsilon }_{s}A/W$, so an independent junction capacitance measurement can constrain the width $W$ of the depletion region under the model assumptions. Other stored electric charge, including injected minority carriers, can also contribute to a measured terminal capacitance.

A junction field-effect transistor controls a conducting semiconductor channel using reverse-biased p-n junctions at its gate. Changing gate voltage changes the depletion region and therefore the cross-section available to mobile charge carriers. A depletion-mode n-channel device normally conducts at zero gate-source voltage and is depleted by a more negative gate. The small reverse gate electric current gives high input resistance, while a source-drain supply provides output power.

Integrating the electric field across a linearly graded p-n junction gives $V_b-V=e\alpha w^3/(12{\epsilon }_s)$, where positive $V$ means forward bias. Thus the depletion region width depends on the cube root of the remaining barrier voltage. Both the space-charge density and integration range grow with width; this differs from the square-root width law of an abrupt uniformly doped junction.

Semiconductor doping introduces impurities with levels close to the band edges. A donor impurity can release an Electron to the conduction band, leaving a fixed positive ion; an n-type semiconductor has Electrons as majority carriers. An acceptor impurity can take an Electron from the valence band, leaving a mobile hole and fixed negative ion; a p-type semiconductor has holes as majority carriers. The opposite species remains as a minority carrier population, and a neutral bulk sample balances the ionised dopants with mobile carriers.

At a p-n junction, concentration gradients initially drive Electrons and holes across the join. Their removal near the join exposes negative acceptor ions on the p side and positive donor ions on the n side, forming a depletion region. Its electric field opposes further majority-carrier diffusion. Equilibrium has a flat Fermi level, no net current and spatially bent band edges. With p on the left and n on the right, the Electron band edges fall towards the n side; the difference is the equilibrium barrier in Electron energy. A flat Fermi level does not mean flat conduction and valence edges.

Doping changes the mobile carrier population by introducing controlled impurity levels. In an intrinsic semiconductor, the filled valence band is separated from the nearly empty conduction band by a band gap $E_g$. Thermal excitation produces an electron-hole pair, so the Electron and hole number densities obey $n=p=n_i$. A electron hole represents a missing valence-band Electron and behaves as a mobile positive charge carrier. For nondegenerate bands in thermal equilibrium,Here $N_C,N_V$ are the effective density of states, $E_C,E_V$ the band edges, and $E_F$ denotes the chemical potential, conventionally called the Fermi level. The semiconductor mass-action law holds in this nondegenerate equilibrium regime.

In a tetrahedrally bonded elemental semiconductor such as silicon, a substitutional group-V atom has an extra outer Electron relative to the host. It is a donor impurity: a shallow level just below $E_C$ can ionise, releasing an Electron to the conduction band and leaving a fixed positively charged donor. The resulting n-type semiconductor has Electrons as majority carriers and holes as minority carriers. Conversely a group-III substitution supplies one fewer bonding Electron. An acceptor impurity can take an Electron from the valence band, leaving a mobile electron hole and a fixed negative acceptor; the resulting p-type semiconductor has holes as majority carriers.

The impurity state is shallow because the Electron or hole responds to a screened Coulomb potential and an effective mass, rather than the bare atomic potential. A simple hydrogenic donor estimate iswhere ${ϵ}_r$ is the relative permittivity. This is a useful scaling model, with real band anisotropy and central-cell effects omitted. Dopants are fixed in the lattice; their ionisation changes mobile carrier numbers without making a uniformly doped bulk sample carry a large net electric charge.

The charge neutrality condition isWhen shallow dopants are almost fully ionised and $N_D-N_A\gg n_i$, an n-type region has $n\simeq N_D-N_A$ and $p\simeq n_i^2/n$. A p-type region similarly has $p\simeq N_A-N_D$ and $n\simeq n_i^2/p$. Thus compensation by the opposite impurity type reduces the majority-carrier density; the total dopant concentration is not generally the mobile carrier density. At sufficiently high impurity density the degenerate semiconductor regime requires the full Fermi-Dirac distribution and these exponential approximations fail.

There are three useful temperature regimes. At low temperature, dopant freeze-out leaves many shallow levels un-ionised. In the extrinsic regime, the dopants are largely ionised and set the majority-carrier density. At high enough temperature, intrinsic pair creation dominates and $n,p$ approach $n_i$. The Fermi level moves towards the conduction band with donor doping and towards the valence band with acceptor doping. The electrical conductivity isDoping therefore controls conductivity and its carrier type, but ionised impurities also scatter carriers and can reduce charge carrier mobility. Carrier density and mobility must both be considered.

A p-n junction forms when p-type and n-type regions are joined within a semiconductor. Initially the concentration gradients drive diffusion current: Electrons diffuse from the n region to the p region and holes in the opposite direction. Recombination removes mobile majority carriers near the join, exposing fixed positive donors on the n side and fixed negative acceptors on the p side. This forms a depletion region and an electric field directed from n to p. Its drift current opposes diffusion. At equilibrium the net current vanishes and the Fermi level is uniform, although the band edges vary spatially through band bending.

For an abrupt nondegenerate junction with fully ionised dopants, its built-in potential isUnder the depletion approximation, the space-charge densities are $-e{N}_A$ on a p-side width $w_p$ and $+e{N}_D$ on an n-side width $w_n$. Integrating Poisson equation and imposing zero field outside gives $N_A{w}_p=N_D{w}_n$ andMost of the depletion width therefore extends into the more lightly doped side. The schematic shows the impurity levels before contact and the resulting space charge and potential after contact; there is no externally extractable equilibrium battery voltage from the built-in field alone.

A forward bias, with p positive relative to n, reduces the barrier from $V_{\mathrm{bi}}$ towards $V_{\mathrm{bi}}-V$ and injects minority carriers across the junction. In the ideal low-injection, diffusion-controlled regime this produces the Shockley diode equation, $I=I_s[e^{eV/(k_{B}T)}-1]$. Reverse bias increases the barrier and the depletion region; only a small thermally generated minority-carrier current flows before breakdown. Reverse-biased depletion regions also give a voltage-dependent junction capacitance. Real devices have recombination, leakage, series resistance and breakdown mechanisms beyond the ideal law. Controlled doping creates majority and minority carriers, and their junction produces a depletion barrier that makes rectification possible.

Take an abrupt equilibrium p-n junction with the p side at $x<0$ and the n side at $x>0$. In the quasi-neutral bulk, electron holes are the majority carriers on the p side and Electrons are the majority carriers on the n side. With ionized dopant densities $N_A,N_D$ and nondegenerate statistics,where $n_i$ is the intrinsic carrier concentration. The semiconductor mass-action law $np=n_i^2$ applies at equilibrium. Both mobile populations are small in the depletion region compared with the dopant densities.

The charge and carrier density of an abrupt p-n junction must distinguish mobile populations from net charge. Diffusion leaves negatively charged ionized acceptor impurities on the p side and positively charged ionized donor impurities on the n side. Under the depletion approximation,The neutral bulks have large carrier densities but nearly zero net charge density. The electric field points from the positive donor region toward the negative acceptor region, balancing diffusion at equilibrium.

The figure uses equal dopant densities only to show a simple symmetric sketch. Generally the more lightly doped side has the wider depleted interval. The carrier profiles are smooth, whereas the step-shaped net charge density is the ideal depletion approximation.

Semiconductor doping introduces controlled impurities to alter equilibrium carrier populations and electrical conductivity. In an intrinsic semiconductor, thermally excited Electrons in the conduction band and electron holes in the valence band have equal densities $n=p=n_i$. A shallow donor impurity, such as phosphorus in silicon, supplies an Electron from an impurity level just below the conduction-band edge. Once ionized it is positively charged, and the material is n type. An acceptor impurity, such as boron in silicon, accepts a valence Electron into a level just above the valence-band edge, leaving a mobile hole and a negatively charged ionized impurity; the material is p type.

With dopant densities $N_D,N_A$, charge neutrality requiresFor fully ionized, nondegenerate dopants at equilibrium, the semiconductor mass-action law gives $np=n_i^2$. In a substantially n-type sample, $N_D-N_A\gg n_i$, soThe corresponding p-type result is $p\simeq N_A-N_D$ and $n\simeq n_i^2/(N_A-N_D)$. The majority population grows while the minority population decreases; adding donors does not simply add equal numbers of free Electrons and holes.

The Fermi energy shifts toward the conduction band for n-type material and toward the valence band for p-type material. In the nondegenerate approximation,where $N_C,N_V$ are effective band-edge state densities. At very low temperature, dopants may not be ionized and carrier freeze-out occurs. At intermediate temperatures, ionized dopants dominate the carrier density; at sufficiently high temperature, intrinsic excitation can dominate. Heavy doping can produce degenerate carrier statistics, invalidating these Boltzmann expressions.

The electrical conductivity is $\boxed{\sigma =e(n{\mu }_e+p{\mu }_h)}$. Doping usually raises the majority carrier density, but ionized impurity scattering can lower mobility, so conductivity need not scale indefinitely with dopant concentration. Joining p-type and n-type regions creates a p-n junction, with a depletion region and built-in electric field established by carrier diffusion and compensating drift. The fixed ionized dopants, not an absence of all charge, account for the depleted region's net charge density.

Take a p-n junction made from one semiconductor, with the p-type semiconductor on the left and the n-type semiconductor on the right. At thermal equilibrium the chemical potential $\mu =E_F$ is horizontal throughout. Before contact the chemical potential lies nearer the valence band on the p side and nearer the conduction band on the n side; after contact the band edges bend to permit one common value.

In this orientation both the conduction band edge $E_C$ and the valence band edge $E_V$ decrease from p to n by $e{V}_{\mathrm{bi}}$. For a homojunction their separation $E_g=E_C-E_V$ is constant. The acceptor impurity level $E_A$ lies just above $E_V$ where acceptors are present, and the donor impurity level $E_D$ lies just below $E_C$ where donors are present. These impurity levels follow the local band bending; they do not form one additional horizontal band across the device.

The shaded depletion region has few mobile Electrons or electron holes and contains fixed negative ionized acceptor impurities on the p side and positive ionized donor impurities on the n side. Thus its electric field points from n to p. Its neutral outer regions have negligible electric field, so the band edges become flat there. In the depletion approximation, charge neutrality requires $N_A{x}_p=N_D{x}_n$; the symmetric drawing illustrates $N_A=N_D$ rather than assuming that equality is universal. Diffusion and field-driven drift current cancel at equilibrium: no applied voltage does not mean zero internal electric field or zero built-in electric potential difference.

A positive electric potential difference between gate and substrate attracts Electrons towards the insulating interface and repels the mobile electron holes of the p-type semiconductor substrate. The exposed, negatively charged acceptor impurities form a depletion region; the thin mobile Electron layer at its surface is the semiconductor inversion layer. The conduction band and valence band bend downwards towards the positively biased gate, because the Electron potential energy is $-e\psi$.

To specify the conventional MOS inversion threshold, let $N_A$ be the ionized acceptor density, $n_i$ the intrinsic carrier concentration, andIn the neutral bulk the intrinsic level lies $e{\varphi }_F$ above the semiconductor chemical potential. A positive surface potential ${\psi }_s$ lowers both band edges by $e{\psi }_s$, giving, in the nondegenerate approximation,At ${\psi }_s={\varphi }_F$, the surface is intrinsic: $n_s=p_s=n_i$. The usual onset of strong inversion instead meansThus the surface electron density has grown to the bulk majority-carrier density. The chemical potential need not actually enter the conduction band. The phrase “just forms” can also refer to the earlier weak-inversion crossover; the diagram uses the conventional strong-inversion threshold and labels it explicitly.

Within the depletion approximation the negative space charge is approximately $-e{N}_A$ over a widthwhere ${ϵ}_s$ is the absolute semiconductor permittivity. Its outer edge is where the bands become flat and mobile electron holes recover their bulk density. The electrical insulator blocks steady carrier transport while sustaining an electric field; the metal gate supplies positive surface charge balancing depletion and inversion charge. Under gate bias, the gate and substrate electrochemical potentials are different, so a single equilibrium Fermi level should not be drawn through the whole biased stack.

Nondegenerate carrier product. Assume three-dimensional parabolic energy bands near their extrema, spin degeneracy two, and no additional uncounted valley multiplicity. Near the conduction edge, a Boltzmann approximation to the Fermi-Dirac distribution givesAngular integration and the Gaussian radial integral yieldFor valence electron holes, the empty-state probability is $1-f(E)\simeq e^{(E-\mu )/(k_{B}T)}$. Measuring electron hole kinetic energy downwards from $E_v$ similarly givesThe factors two count spin once in each band. Multiplying cancels the chemical potential and proves the semiconductor mass-action law:In an intrinsic neutral semiconductor, $n=p=n_i$. In a doped equilibrium semiconductor the same product holds under the stated nondegenerate assumptions, even when $n\ne p$. Extra valleys or several valence branches must be included in the effective density-of-states factors rather than counted inconsistently.

Equilibrium junction. Put the p region on the left and the n region on the right. Before contact their majority carriers are electron holes and Electrons, respectively. Diffusion initially sends Electrons from n to p and electron holes from p to n. This leaves negative ionized acceptors on the p side and positive ionized donors on the n side, creating a depletion region and an electric field directed from n to p. At equilibrium this field balances diffusion, so the net electric current vanishes.

For a homojunction the gap remains constant while the conduction band and valence band edges bend downwards from p to n by $e{V}_{\mathrm{bi}}$. The equilibrium chemical potential is flat. Since $E_{c,v}(x)=E_{c,v}^{\mathrm{ref}}-e\varphi (x)$, the electrostatic potential rises from p to n. The carrier profiles satisfyWith fully ionized nondegenerate dopants, the neutral p side has $p_p\simeq N_A$, $n_p\simeq n_i^2/N_A$, while the neutral n side has $n_n\simeq N_D$, $p_n\simeq n_i^2/N_D$. Thus the Electron concentration rises across the junction and the electron hole concentration falls, with both small relative to the far-side majority densities in much of the depleted region. The ideal depletion approximation neglects these mobile populations when calculating the fixed space electric charge, but the actual equilibrium profiles are smooth.

The built-in potential follows from these Boltzmann factors:There is no applied terminal bias; the internal electrostatic potential variation does not contradict a constant electrochemical potential.

Opposing carrier fluxes under reverse bias. Use $V>0$ for the magnitude of reverse bias and $I>0$ for reverse electric current, as in the PDF. The junction barrier increases by $eV$. The Shockley diode equation in that orientation can be writtenThe reverse-directed contribution is supplied by minority Electrons on the p side and minority electron holes on the n side. They reach the depletion edge by diffusion and are swept across by the built-in field. The opposing contribution is associated with majority carriers thermally crossing the barrier in the forward direction; reverse bias suppresses it by the Boltzmann factor. At zero bias detailed balance makes the two equal, while at large enough reverse bias the opposing flux becomes negligible.

In the ideal neutral-region diffusion model,Here $D_n,D_p$ are minority-carrier diffusion coefficients, $L_n,L_p$ their diffusion lengths, and $\mathcal{A}$ is junction area. The two terms inside this positive prefactor are the Electron and electron hole contributions; both flow in the same reverse-current direction. This separates the two carrier-species contributions from the two opposing fluxes in the Shockley diode equation. Calling the saturation term a drift current refers to its passage across the depleted region, and does not eliminate the minority-carrier diffusion needed to supply it.

Reading the measured curves. At $eV\ll k_{B}T$, the ideal equation gives $I\simeq I_{\mathrm{sat}}eV/(k_{B}T)$, initially proportional to reverse electric potential difference. At $eV\gg k_{B}T$, it approaches a plateau $I\simeq I_{\mathrm{sat}}$. The thermal electric potential differences at the three temperatures are about $21$–$26\mathrm{mV}$, consistent with a rise at small reverse biases and near saturation at larger ones. Higher temperature produces a much larger plateau because thermal electron-hole excitation raises $n_i^2$ exponentially.

The lower-temperature curve has a noticeable residual electric potential difference dependence rather than a perfectly flat plateau. Depletion-region generation, surface leakage or other departures from the ideal diffusion model can contribute. The sharp upturn at the largest reverse electric potential differences is reverse breakdown, outside the unextended Shockley diode equation; the plot alone does not identify a unique microscopic breakdown mechanism. The original horizontal axis duplicates the final decade label, so a precise breakdown electric potential difference cannot be read reliably. Neither issue prevents estimating the gap from the intermediate-bias saturation region.

Band-gap estimate. Use plateau electric currents at a common intermediate reverse bias, away from both the small-bias rise and the breakdown upturn. Approximate readings are $I_{\mathrm{sat}}(298\mathrm{K})\sim 2.5\times 10^{-6}\mathrm{A}$, $I_{\mathrm{sat}}(273\mathrm{K})\sim 1.5$–$2\times 10^{-7}\mathrm{A}$, and $I_{\mathrm{sat}}(248\mathrm{K})\sim 10^{-8}\mathrm{A}$. Kelvin temperatures are required in the activation law.

For fixed effective masses, $n_i^2\propto T^3{e}^{-E_g/(k_{B}T)}$. If the remaining transport prefactor is approximately constant, extracting a semiconductor band gap from diode saturation current therefore usesUsing the widest temperature separation and the rounded readings givesNeglecting all algebraic prefactors and fitting $\ln I_{\mathrm{sat}}$ instead gives about $0.70\mathrm{eV}$. These differ by roughly $0.07\mathrm{eV}$, a material correction on the graph's precision scale. Thus an honest graph-based conclusion isThe nonflat low-temperature plateau, rough electric current readings, unprovided temperature dependence of $D/L$, and possible gap variation prevent a more precise extraction. If depletion-region generation dominated rather than the specified $I_{\mathrm{sat}}\propto n_i^2$ mechanism, its activation slope could involve a different energy scale; the displayed estimate explicitly uses the diffusion-dominated saturation model requested here.

A junction field-effect transistor has a conducting channel between source and drain, with gate regions forming reverse-biased p-n junctions to that channel. In an n-channel device, a more negative gate-source electric potential difference increases the reverse bias and widens the depletion region. The conducting cross-section shrinks, reducing the drain electric current. The gate ideally draws only a small leakage electric current, giving a high input resistance; the source-drain supply provides the controlled output power. Carrier motion in a p-channel device reverses the relevant polarities.

At small positive $V_{DS}$, the channel conducts approximately as a resistor. As the potential rises from source to drain, the local gate-channel reverse bias increases toward the drain. The depletion layers are therefore thicker there. For a symmetric n channel of half-thickness $a$, uniformly doped at density $N_D$, the one-sided depletion approximation giveswhere $w$ is the depletion width from each side and $V_{\mathrm{bi}}$ the built-in junction potential. The neutral channel closes locally when $w=a$. Define the positive geometrical depletion electric potential difference $U_P=e{N}_D{a}^2/(2{\epsilon }_s)$. The approximate drain-end pinch-off condition isMore negative gate bias makes this saturation occur at a smaller drain electric potential difference.

Pinch-off in a junction field-effect transistor does not mean that the drain electric current vanishes. Electrons arriving through the remaining neutral channel are swept across the high-field depleted region into the drain. Further increases in $V_{DS}$ mostly fall across that region, so the electric current changes only weakly: this is the saturation regime used for amplification. Channel shortening gives a finite output slope in real devices. Excessive reverse electric potential difference eventually causes breakdown, beyond the normal saturation model.

A sufficiently negative gate electric potential difference can instead deplete the entire channel from the source end and produce cutoff. In the simplified geometry its threshold is $V_{GS,\mathrm{off}}\simeq V_{\mathrm{bi}}-U_P<0$. A commonly used approximate transfer law in saturation isHere $I_{DSS}$ is the saturated drain electric current at zero gate-source bias. The square law is a useful device approximation, not an exact result for arbitrary channel profiles. It connects field control of depletion to a measurable transfer characteristic while keeping drain-end pinch-off distinct from complete gate cutoff.

A positive gate voltage attracts Electrons towards the oxide interface of the p-type semiconductor and repels mobile electron holes. The uncovered ionized acceptors form a negatively charged depletion region. Increasing the voltage further creates a thin electron-rich semiconductor inversion layer at the surface. The conduction band and valence band both bend downwards towards the positively biased gate, because an electron's electrostatic energy is $-e\psi$.

In an ideal nondegenerate substrate with acceptor density $N_A$, write ${\varphi }_F=(k_{B}T/e)\ln (N_A/n_i)>0$ and surface potential ${\psi }_s$ relative to the neutral bulk. The electron and hole surface densities areThe first change of majority-carrier type occurs at ${\psi }_s={\varphi }_F$, where $n_s=p_s=n_i$. The conventional MOS inversion threshold for appreciable strong inversion isAt threshold the inversion sheet is just developing, while a much thicker depletion region lies between it and the neutral p-type bulk. Inversion does not require the conduction band to cross the Fermi level: the surface can remain nondegenerate.

The metal and semiconductor Fermi levels need not be equal. The ideal oxide blocks particle exchange, so the gate and substrate can maintain different electrochemical potentials. In a biased MOSFET, the gate-to-substrate Fermi-level difference is ${\tilde{\mu }}_g-{\tilde{\mu }}_s=-e{V}_g$, when the applied voltage is defined in the electron-reservoir convention. Each region can separately be in internal equilibrium. If an external zero-voltage connection instead equilibrates the reservoirs, their Fermi levels coincide, but different work functions can still cause band bending. Here the chemical potential shown in a band diagram is the electron electrochemical potential; the purely chemical contribution alone is not the equilibrium criterion for charged particles.

Equilibrium junction. Put the p-type side on the left and n-type side on the right. When they are joined, Electrons diffuse from n to p and electron holes diffuse from p to n. This leaves negative ionized acceptors on the p-side and positive ionized donors on the n-side of the depletion region. The resulting built-in electric field points from n to p, opposing further diffusion. At equilibrium there is one constant Fermi level, and drift and diffusion currents cancel for each carrier species.

In the nondegenerate, fully ionized limit, the neutral-region carrier densities areThe conduction band and valence band lie higher on the p-side and bend down towards the n-side. The gap between them stays fixed for a homojunction. If $\psi$ increases towards the n-side, both edges shift by $-e\psi$, whileThus $n$ rises and $p$ falls continuously across the junction; neither mobile population is an exact step function. Their depletion exposes fixed dopant charge density, rather than an absence of every kind of charge. The built-in voltage is

Light emission. Forward bias lowers the barrier and injects minority carriers across the p-n junction. In a light-emitting diode, electron-hole recombination converts some of their energy into photons. A direct band gap permits efficient radiative transitions with nearly conserved crystal momentum; nonradiative channels compete. Near-edge emission has $\hslash \omega \simeq E_g$ and $\lambda \simeq hc/E_g$. Material composition and confinement select the emission colour. Reverse-bias saturation is not the ordinary LED operating mode.

Reverse current. Take $V=V_R>0$ and $I_R>0$ to mean reverse voltage and reverse current magnitudes. The Shockley diode equation in this convention isThe bias-independent $I_S$ term is the supply of thermally excited minority carriers from the neutral regions, swept across the junction by its electric field. The opposing injection current is reduced by the extra barrier energy $e{V}_R$ and is $I_S{e}^{-e{V}_R/(k_{B}T)}$. Their equality gives zero net current at zero bias; for $e{V}_R\gg k_{B}T$, the reverse current approaches $I_S$ until leakage or breakdown invalidates this ideal law. The collecting field need not create the minority carriers; their thermal supply limits the diffusion-dominated current.

For an ideal long junction of area $\mathcal{A}$, steady diffusion with recombination gives the diode minority-carrier diffusion currentIt depends on doping, geometry, carrier diffusion coefficients and lifetimes, and especially the intrinsic carrier concentration. Depletion-region generation current and surface leakage can add nonideal contributions to the measured reverse current.

Band-gap estimate from the data. Read a nearly flat region well above the small-bias knee and below the high-bias upturn, rather than estimating $I_S$ in the breakdown region. For a diffusion-dominated junction with nearly temperature-independent gap and effective masses,so $I_S=C(T)T^3{e}^{-E_g/(k_{B}T)}$, where $C(T)$ includes transport and doping factors. Extracting a semiconductor band gap from diode saturation current amounts to measuring the slope of $\ln [I_S/(C(T)T^3)]$ against $1/T$: it is $-E_g/k_B$. If the prefactor is taken approximately constant over a short interval,Approximate readings from the original PDF plateaus areUsing the two warmer curves and $k_B=8.6173\times 10^{-5}eV/K$ givesKeeping the $T^3$ factor but taking the residual transport factor constant changes this estimate to approximately $0.57\mathrm{eV}$. The justified graphical estimate is thereforeThe colder curve is a genuine limitation of the supplied data: the $0$ to $-45{}^{\circ }\mathrm{C}$ pair gives only about $0.32\mathrm{eV}$ with a constant prefactor, and the endpoint pair gives about $0.42\mathrm{eV}$. Thus all three cannot support one precise diffusion-only activation slope. A depletion-region generation current, approximately proportional to $n_i$ rather than $n_i^2$, can have a roughly half-gap activation energy; other leakage and temperature-dependent transport can also alter the slope. The PDF alone does not identify their relative contributions. A reliable precision gap measurement would use more temperatures and verify the transport regime instead of forcing one fit through these three readings.

Write ${\epsilon }_s={ϵ}_0ϵ$ and take $e>0$, $\alpha >0$, so the p side is $x<0$. In the depletion approximation, mobile Electrons and electron holes are negligible compared with the fixed ionized dopants. Their charge density isApplying Poisson equation givesOutside the depletion region, mobile carriers approximately neutralize the dopants, so $\rho \simeq 0$ and $V^{\prime \prime }\simeq 0$. Full dopant ionization alone does not remove the mobile-carrier charge: the result also requires the depletion approximation.

At equilibrium, majority Electrons undergo diffusion from n to p, while majority electron holes diffuse from p to n. Their departure exposes positive donors on the n side and negative acceptors on the p side. The resulting electric field points from n to p and opposes further diffusion. Equilibrium is reached when the chemical potential is constant across the junction. The built-in potential is this electrostatic adjustment, not a discontinuity of the material's band gap.

Since electronic band energies shift by $-eV(x)$, both the conduction band and valence band undergo band bending down from p to n by $e{V}_b$ at zero applied bias. Their separation remains the same gap. In the nondegenerate thermal equilibrium limit the built-in voltage can also be expressed using neutral-edge densities as $e{V}_b=k_{B}T\log (n_n/n_p)=k_{B}T\log (n_n{p}_p/n_i^2)$.

Take the n-contact potential and its electrochemical potential as reference. Applying $V_{\mathrm{ext}}$ to the p side changes the total depletion-layer drop toThus $V_{\mathrm{ext}}<0$ is reverse bias: it increases the barrier and widens the depletion region. The bands have horizontal tangents at the neutral edges in this approximation and a smooth cubic bend within the linearly graded layer.

A biased junction is not in global thermal equilibrium. Its contact electron electrochemical potentials obeyUnder reverse bias the p-contact level is higher by $e|V_{\mathrm{ext}}|$. A single horizontal equilibrium chemical potential cannot describe this state; electron and hole quasi-Fermi levels describe the nonequilibrium populations. The sketch marks the contact levels. Detailed spatial quasi-Fermi profiles require transport and recombination information beyond the electrostatic doping profile.