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Locate an isolated nanowire first, then align source, drain, dielectric and top-gate patterns to it. A suitable research-device sequence is the following; the semiconductor is unspecified, so contact-barrier and surface-cleaning details cannot be assumed universally ohmic.

Prepare a clean electrically insulating substrate, with alignment marks. Disperse a sparse population of nanowires from the suspension, remove the carrier solvent compatibly, and locate a suitable isolated wire by microscopy. Record its position relative to the marks.

Use aligned electron beam lithography and a suitable lift-off process to open contact regions near the two ends while leaving a central channel. Clean the exposed contact regions without destroying the wire, evaporate gold and lift off. The contacts overlap the ends but do not bridge the central channel; test their electrical behavior before assuming an ohmic response.

In a second aligned pattern, define a central dielectric patch that extends beyond the proposed gate edges. Evaporate the specified silicon monoxide and lift off using a profile that permits film separation. Verify coverage over the wire and absence of pinholes: directional deposition onto curved nanoscale geometry is not automatically conformal.

Define and evaporate a gold top gate over that insulated central patch, with its lead kept electrically separated from the source, drain and wire. Lift off and test gate leakage before extracting transistor characteristics. The dielectric must remain continuous under the gate and overlap its edges; the illustrated central gate is not a third direct metal contact to the semiconductor. Gold and silicon monoxide are used as stipulated, without silently replacing SiO by a different oxide.

Conventional semiconductor scanning capacitance microscopy is not a reliable dopant-contrast image of this specimen as drawn. Its usual $dC/dV$ signal relies on a tip–insulator–semiconductor capacitance whose depletion region changes under AC bias. An isolated conducting graphene sheet on thick insulating glass provides neither that conventional depletion geometry nor a controlled charge reservoir; simply earthing glass does not supply one. Capacitive or electrostatic contrast may be detectable with a suitably designed back electrode, a contacted flake and an appropriate capacitance-sensitive instrument, but that is an additional electrical device specification. Force-based surface topography remains possible independently of the specialized capacitance channel.

One workable route uses two resist coatings and a metal-defined optical aperture. The following are eleven fabrication operations; exposure/development is grouped as one lithographic operation, and rear metallization includes its contact activation if required. Detailed cleaning, rinsing and inspection occur between compatible operations.

1. Spin-coat a first photoresist on the front surface to define a mesa mask.
2. Expose and develop that mask, retaining resist over the complete active-cell mesa, including its future front contacts.
3. Etch the exposed semiconductor through the p-type layers and slightly into the n-type base. This removes the unwanted junction around the cell and produces the lateral mesa step.
4. Strip the first photoresist, leaving a clean mesa with its cap intact.
5. Spin-coat a second photoresist suitable for the lift-off process.
6. Expose and develop openings at the intended front grid or contact pads, positioned safely inside the mesa edge.
7. Evaporate a p-contact metal stack onto the exposed gallium arsenide and resist. Au/Zn-based contact metallization is a conventional candidate, subject to doping and contact-resistance qualification.
8. Dissolve the second photoresist to lift off unwanted metal, leaving the front contacts on the cap.
9. Selectively remove the cap from the light-receiving aperture, using the front metal as a hard mask and the aluminium gallium arsenide window as the etch stop.
10. Deposit the rear n-contact metallization, for example a qualified AuGe/Ni/Au system, with an appropriate contact-activation anneal if required and compatible with the front contact.
11. Deposit an antireflection dielectric over the optical aperture through a mechanical shadow mask that keeps the contact pads accessible. Its refractive index and thickness are chosen for the target optical band.

The essential material changes are junction isolation at the mesa edge, metal retained on the front cap, cap removed only from the optical aperture, and a conducting rear contact. The metal systems and anneal are a process design, not compositions specified by the drawing. A workable design must also qualify the passivation of etched sidewalls and the front-contact surface preparation.

Mesa definition comes first so that the two front contacts can be aligned to an already isolated active area and can avoid damaged mesa edges. Keeping the cap until after metallization provides the intended contact surface and protects the window during the contact process. lift-off process must precede selective cap removal if the retained metal is to act as that etch mask. The cap etch must stop above the emitter rather than destroy the junction.

Rear metallization after the wet-processing stages avoids unnecessarily exposing the rear contact to their etchants. Contact activation precedes the optical coating where possible, because the anneal can alter dielectric properties and optical thickness. The antireflection coating goes last and leaves the pads uncoated for electrical access. The key ordering constraints are clean semiconductor before contacts, electrical isolation without severing the intended current path, selective aperture opening, and a thermal budget compatible with every retained layer. If a different metal or etchant requires a changed order, it must preserve these same functions.

n-type doping adds donor impurities with weakly bound electrons near the conduction-band edge; ionization supplies conduction electrons and leaves positive donor ions. p-type doping introduces acceptors near the valence-band edge, producing holes and negatively charged ionized acceptors. Silicon and germanium commonly use group-V donors and group-III acceptors; dopant behaviour in a compound semiconductor depends on its lattice site.

Doping sets carrier concentration, Fermi level and resistivity. Spatially patterned donor and acceptor regions form p-n junctions, transistor source/drain regions and electrical contacts; remote doping can supply carriers to a cleaner conducting layer. Compensation and incomplete ionization mean carrier density need not equal the total impurity concentration.

For longitudinal motion in transverse subband $i$,For a completely free particle take $E_i=0$ and use the full wave vector. In a semiconductor the parabolic-band mass is the appropriate effective mass rather than necessarily the bare electron mass.

At low carrier concentration, $|S|$ can be large but electrical conductivity is too small. Increasing the carrier concentration usually increases $\sigma =ne\mu$, while $|S|$ decreases. Electronic thermal conductivity rises approximately as ${\kappa }_e=L\sigma T$ by the Wiedemann-Franz law; lattice conduction supplies an additional background. Thus neither an insulator nor an ordinary metal usually maximizes $Z$.

Heavily doped semiconductors and semimetals often give the useful compromise, near a maximum of $S^2\sigma /\kappa$ as doping is varied. The optimum is material- and temperature-dependent; there is no universal optimal concentration.

Grow the semiconductor stack epitaxially by molecular beam epitaxy or metalorganic vapor-phase epitaxy on a suitable crystalline GaAs substrate. Sequential changes of source flux or precursor supply set the GaAs/AlGaAs compositions, while dopant supply sets the n-type and p-type regions. Growth time and calibrated rate control the thicknesses of the InGaAs quantum well and the alternating reflector layers.

epitaxy preserves a common crystal orientation and clean, abrupt semiconductor interfaces. These are important both for carrier confinement in the quantum well and for low-loss optical reflection. For a DBR centered at free-space wavelength ${\lambda }_0$, the approximate quarter-wave condition is $n_j{d}_j={\lambda }_0/4$ in each layer. Ordinary deposition of a polycrystalline coating would not provide the required active semiconductor heterostructure.

The contact dimensions are readily accessible to UV photolithography followed by directional evaporation and lift-off. A possible sequence is:

A real device must also have appropriate ohmic contact metallurgy. gold alone on arbitrary GaAs is not automatically an ohmic contact: surface preparation, heavy contact-layer doping and, where required, a suitable alloyed contact stack are needed. The schematic gold label specifies the visible electrode, not all such process details. Order the mesa etch and contact steps so that the etchant and any anneal do not damage an already formed contact.

For one homogeneous thermoelectric material, the dimensional thermoelectric figure of merit isThe dimensionless quantity is $ZT$. The Seebeck coefficient $S$ measures the open-circuit voltage response to a temperature difference and reflects the energy asymmetry of charge-carrier transport. The electrical conductivity $\sigma$ depends on carrier density and mobility and sets electrical loss; $\rho =1/\sigma$. The thermal conductivity is $\kappa ={\kappa }_e+{\kappa }_l$, with contributions from carriers and phonons, and represents unwanted heat leakage.

Increasing carrier concentration usually raises $\sigma$ while reducing $|S|$ once transport becomes strongly degenerate. The electronic part of $\kappa$ also tends to rise, approximately through the Wiedemann-Franz law where applicable. This competition produces an intermediate optimum, commonly in heavily doped semiconductors, rather than in a very resistive insulator or an ordinary high-carrier-density metal. The optimum depends on band structure and scattering; the schematic is not a universal measured concentration curve.

In a periodic crystal potential, atomic levels broaden into bands of allowed bloch states. Coupling between states of the same symmetry opens avoided crossings, including Bragg-coupled states in the nearly free-electron picture. Bonding and antibonding combinations provide a complementary tight-binding picture. A semiconductor has a filled valence band and an empty conduction band at zero temperature separated by a forbidden energy interval; thermal excitation, light and doping provide mobile electrons and holes. The gap depends on the crystal's periodic potential, bonding and symmetry, not on a classical collision barrier. In a direct gap, the relevant extrema coincide in wavevector.

For the stated parabolic edges, take $E_v(k)=-{\hslash }^2{k}^2/(2m_h^{\ast })$ and $E_c(k)=E_g+{\hslash }^2{k}^2/(2m_e^{\ast })$. Negligible photon momentum and no phonon make the transition nearly vertical in $E$ versus $k$. parabolic-band optical energy sharing divides the excess photon energy $0.32\mathrm{eV}$ in inverse proportion to the effective masses:Thus the initial and final electron energies, relative to the valence-band maximum, areTheir difference is $0.5000\mathrm{eV}$. The selected $|k|$ is about $9.33\times 10^8{\mathrm{m}}^{-1}$; either sign gives the same energy in this symmetric approximation.

A shallow donor supplies an electron in a screened impurity potential, so its localized level lies just below the conduction edge. A shallow acceptor binds a hole and has an electron-occupation level just above the valence edge; thermal ionization supplies mobile holes. The level positions are measured relative to the relevant band edge, and deep impurities need not obey this hydrogenic approximation.

For the supplied bound-carrier mass and unit effective ionic charge, dielectric screening and effective mass change the hydrogen binding energy toThis corresponds to $E_b/k_B\simeq 110\mathrm{K}$ and an effective Bohr radius about $6.35\mathrm{nm}$. The binding is shallow compared with the band gap and typical atomic binding. Trivalent denotes chemical valence, not an unscreened hydrogenic charge of three. An acceptor physically binds a hole; the question's stated $0.1m_e$ is used as its stipulated bound-carrier mass rather than silently replacing it by the separate band-edge $0.4m_e$.

A p-n junction brings p-type and n-type regions into contact. Majority-carrier diffusion initially leaves exposed ionized acceptors and donors, producing a depletion region and a built-in potential. At thermal equilibrium the electrochemical potential is constant: drift and diffusion currents cancel. The internal barrier is not a freely extractable battery voltage.

For a nondegenerate abrupt homojunction,Here $V>0$ denotes forward bias and the depletion approximation is assumed. forward bias lowers the barrier and injects minority carriers; reverse bias widens the depleted region and suppresses ordinary majority injection. In the ideal diffusion regime,Recombination can change the ideality factor; series resistance, high-level injection, leakage and breakdown limit this simple Shockley diode equation. The original junction theory explicitly treats both electron and hole currents, which is essential to carrier injection and transistor action.^[ref]

As a rectifying diode, the junction conducts strongly in one bias direction and weakly in the other before breakdown. This permits power rectification, signal detection and electronic switching. Stored minority charge affects turn-off time, so a static exponential current-voltage relation alone does not specify switching speed. A junction capacitance $C_j\simeq {ϵ}_{s}A/W$ varies with reverse bias and can be used in a voltage-controlled capacitor; heavily doped or high-field junctions can instead exploit controlled tunnelling or avalanche breakdown.

In a photodiode, absorbed photons generate electron-hole pairs and the depleted-region field assists collection. reverse bias widens the collecting region and can improve speed, but adds dark-current noise and breakdown constraints. In a solar cell, the same carrier generation supplies current against an external voltage. An ideal illuminated characteristic is $I=I_s(e^{qV/(k_{B}T)}-1)-I_{\mathrm{ph}}$: at open circuit the forward diode current balances photocurrent, while useful power is taken at an intermediate operating point. Neither short circuit nor open circuit delivers power to a load.

A forward-biased light-emitting diode injects electrons and holes that can recombine radiatively. Efficient emission favors suitable direct-gap materials and carrier confinement; the characteristic photon energy is near the semiconductor band gap. nonradiative recombination, escape losses, series resistance and heating limit efficiency. Two coupled junctions also form a bipolar junction transistor: an emitter injects minority carriers through a thin base, and a reverse-biased collector collects them. Useful current gain depends on efficient injection and limited base recombination, not simply on joining any three arbitrary regions.

These functions are experimentally distinguished by measuring dark and illuminated current-voltage curves, bias-dependent capacitance, transient switching or optical emission, with controlled temperature and current limits. The common mechanism is bias-controlled carrier injection or collection at a depletion barrier; the device geometry and operating mode determine which function is useful.

A semiconductor has a filled valence band and an empty conduction band at zero temperature in the intrinsic idealisation, separated by a modest band gap. Thermal excitation or deliberately introduced impurities can create mobile electrons and electron holes. Its conductivity is consequently very sensitive to temperature and doping. A metal has available electronic states at the occupied energy boundary, through a partly filled band or overlapping bands, and need not thermally excite carriers across a gap.

For a direct band gap, the conduction-band minimum and valence-band maximum occur at the same crystal momentum. An electron can recombine with a hole near these extrema and emit a photon while conserving crystal momentum, since optical photon momentum is small on the lattice scale. For an indirect band gap, the extrema lie at different crystal momenta. A band-edge radiative transition then ordinarily needs a phonon as well, making it less probable and allowing nonradiative processes to compete more effectively.

gallium arsenide has a direct fundamental gap, while silicon has an indirect one. This makes efficient band-edge emission and hence a light-emitting diode easier to obtain from gallium arsenide. It does not mean silicon has no optical transitions or that every direct-gap sample emits efficiently: defects, surfaces and carrier confinement also matter.

Doping changes the mobile carrier population by introducing controlled impurity levels. In an intrinsic semiconductor, the filled valence band is separated from the nearly empty conduction band by a band gap $E_g$. Thermal excitation produces an electron-hole pair, so the electron and hole number densities obey $n=p=n_i$. A electron hole represents a missing valence-band electron and behaves as a mobile positive charge carrier. For nondegenerate bands in thermal equilibrium,Here $N_C,N_V$ are the effective density of states, $E_C,E_V$ the band edges, and $E_F$ denotes the chemical potential, conventionally called the Fermi level. The semiconductor mass-action law holds in this nondegenerate equilibrium regime.

In a tetrahedrally bonded elemental semiconductor such as silicon, a substitutional group-V atom has an extra outer electron relative to the host. It is a donor impurity: a shallow level just below $E_C$ can ionise, releasing an electron to the conduction band and leaving a fixed positively charged donor. The resulting n-type semiconductor has electrons as majority carriers and holes as minority carriers. Conversely a group-III substitution supplies one fewer bonding electron. An acceptor impurity can take an electron from the valence band, leaving a mobile electron hole and a fixed negative acceptor; the resulting p-type semiconductor has holes as majority carriers.

The impurity state is shallow because the electron or hole responds to a screened Coulomb potential and an effective mass, rather than the bare atomic potential. A simple hydrogenic donor estimate iswhere ${ϵ}_r$ is the relative permittivity. This is a useful scaling model, with real band anisotropy and central-cell effects omitted. Dopants are fixed in the lattice; their ionisation changes mobile carrier numbers without making a uniformly doped bulk sample carry a large net electric charge.

The charge neutrality condition isWhen shallow dopants are almost fully ionised and $N_D-N_A\gg n_i$, an n-type region has $n\simeq N_D-N_A$ and $p\simeq n_i^2/n$. A p-type region similarly has $p\simeq N_A-N_D$ and $n\simeq n_i^2/p$. Thus compensation by the opposite impurity type reduces the majority-carrier density; the total dopant concentration is not generally the mobile carrier density. At sufficiently high impurity density the degenerate semiconductor regime requires the full Fermi-Dirac distribution and these exponential approximations fail.

There are three useful temperature regimes. At low temperature, dopant freeze-out leaves many shallow levels un-ionised. In the extrinsic regime, the dopants are largely ionised and set the majority-carrier density. At high enough temperature, intrinsic pair creation dominates and $n,p$ approach $n_i$. The Fermi level moves towards the conduction band with donor doping and towards the valence band with acceptor doping. The electrical conductivity isDoping therefore controls conductivity and its carrier type, but ionised impurities also scatter carriers and can reduce charge carrier mobility. Carrier density and mobility must both be considered.

A p-n junction forms when p-type and n-type regions are joined within a semiconductor. Initially the concentration gradients drive diffusion current: electrons diffuse from the n region to the p region and holes in the opposite direction. Recombination removes mobile majority carriers near the join, exposing fixed positive donors on the n side and fixed negative acceptors on the p side. This forms a depletion region and an electric field directed from n to p. Its drift current opposes diffusion. At equilibrium the net current vanishes and the Fermi level is uniform, although the band edges vary spatially through band bending.

For an abrupt nondegenerate junction with fully ionised dopants, its built-in potential isUnder the depletion approximation, the space-charge densities are $-e{N}_A$ on a p-side width $w_p$ and $+e{N}_D$ on an n-side width $w_n$. Integrating Poisson equation and imposing zero field outside gives $N_A{w}_p=N_D{w}_n$ andMost of the depletion width therefore extends into the more lightly doped side. The schematic shows the impurity levels before contact and the resulting space charge and potential after contact; there is no externally extractable equilibrium battery voltage from the built-in field alone.

A forward bias, with p positive relative to n, reduces the barrier from $V_{\mathrm{bi}}$ towards $V_{\mathrm{bi}}-V$ and injects minority carriers across the junction. In the ideal low-injection, diffusion-controlled regime this produces the Shockley diode equation, $I=I_s[e^{eV/(k_{B}T)}-1]$. Reverse bias increases the barrier and the depletion region; only a small thermally generated minority-carrier current flows before breakdown. Reverse-biased depletion regions also give a voltage-dependent junction capacitance. Real devices have recombination, leakage, series resistance and breakdown mechanisms beyond the ideal law. Controlled doping creates majority and minority carriers, and their junction produces a depletion barrier that makes rectification possible.

The quantum free electron model treats conduction electrons as independent particles moving in an approximately constant potential, with parabolic dispersion relation $E={\hslash }^2{k}^2/(2m)$. Fermi-Dirac statistics successfully explains important features such as a Fermi energy and a small electronic heat capacity, but a constant potential gives no band gaps and cannot by itself explain why different band fillings produce metals, semiconductors and band insulators. It also misses lattice-dependent effective masses, detailed directional responses and the topology of real Fermi surfaces. Scattering and finite electrical resistivity require additional physics.

The nearly-free electron model introduces a weak periodic lattice potential. Bloch's theorem replaces individual free plane waves by Bloch states, and Fourier components of the potential mix plane waves whose wavevectors differ by a reciprocal lattice vector. Near degeneracy at a Brillouin zone boundary, this coupling opens a band gap; for a two-wave crossing its size is $2|V_G|$. Away from the crossing, energies remain close to free-particle values. Band curvature produces band effective masses, and band filling determines whether the Fermi energy lies inside an allowed band or a gap.

The improvement is the inclusion of lattice periodicity, rather than a switch from classical to quantum statistics: the quantum free electron model already uses Fermi-Dirac statistics. The strong delta barriers in the later numerical example are treated exactly by the Kronig-Penney model, rather than by assuming that their strength is perturbatively small.

Take a p-n junction made from one semiconductor, with the p-type semiconductor on the left and the n-type semiconductor on the right. At thermal equilibrium the chemical potential $\mu =E_F$ is horizontal throughout. Before contact the chemical potential lies nearer the valence band on the p side and nearer the conduction band on the n side; after contact the band edges bend to permit one common value.

In this orientation both the conduction band edge $E_C$ and the valence band edge $E_V$ decrease from p to n by $e{V}_{\mathrm{bi}}$. For a homojunction their separation $E_g=E_C-E_V$ is constant. The acceptor impurity level $E_A$ lies just above $E_V$ where acceptors are present, and the donor impurity level $E_D$ lies just below $E_C$ where donors are present. These impurity levels follow the local band bending; they do not form one additional horizontal band across the device.

The shaded depletion region has few mobile electrons or electron holes and contains fixed negative ionized acceptor impurities on the p side and positive ionized donor impurities on the n side. Thus its electric field points from n to p. Its neutral outer regions have negligible electric field, so the band edges become flat there. In the depletion approximation, charge neutrality requires $N_A{x}_p=N_D{x}_n$; the symmetric drawing illustrates $N_A=N_D$ rather than assuming that equality is universal. Diffusion and field-driven drift current cancel at equilibrium: no applied voltage does not mean zero internal electric field or zero built-in electric potential difference.

Thomas-Fermi screening treats the carrier density locally as that of a uniform electron gas whose chemical potential is shifted by the slowly varying electrostatic potential. Linearizing gives $\delta n=(\partial n/\partial \mu )e\phi$ for electrons. The resulting screened Poisson equation has inverse screening lengthFor a degenerate gas, $\partial n/\partial \mu =g_{\mathrm{vol}}(E_F)$ including both spins, giving Thomas-Fermi screening length $k_s^{-1}$. A nondegenerate semiconductor instead has $\partial n/\partial \mu =n/(k_{B}T)$, giving the Debye length $\sqrt{\epsilon k_{B}T/(n{e}^2)}$. Electrons and holes contribute additively to the charge susceptibility when both are present; the lattice permittivity replaces the vacuum value.

The approximation requires a potential varying slowly compared with microscopic electronic length scales and a small perturbation for the linearized result. It captures smooth electrostatic screening, but not the full nonlocal response or Friedel oscillations. Low carrier density or carrier freeze-out can make a semiconductor's screening much weaker than a metal's.

For photon absorption or emission, electron energy changes by $\pm \hslash \omega$ and crystal wavevector by $\pm \mathbf{q}$ modulo a reciprocal lattice vector. Optical photon momentum is normally tiny on the Brillouin zone scale, so interband optical transitions are approximately vertical on an energy-wavevector diagram. A direct-gap semiconductor can therefore absorb a photon between valence and conduction states near the same wavevector; an indirect transition usually needs an additional phonon or another source of momentum. Occupation and optical matrix elements impose further restrictions.

Within one ideal parabolic band of a clean metal, such a small photon momentum cannot normally supply the required finite energy difference. Intraband optical absorption then relies on momentum relaxation by impurities, phonons or boundaries, as in the finite-scattering-time Drude response. Interband transitions can still occur. The first panel shows the near-vertical direct transition.

A positive electric potential difference between gate and substrate attracts electrons towards the insulating interface and repels the mobile electron holes of the p-type semiconductor substrate. The exposed, negatively charged acceptor impurities form a depletion region; the thin mobile electron layer at its surface is the semiconductor inversion layer. The conduction band and valence band bend downwards towards the positively biased gate, because the electron potential energy is $-e\psi$.

To specify the conventional MOS inversion threshold, let $N_A$ be the ionized acceptor density, $n_i$ the intrinsic carrier concentration, andIn the neutral bulk the intrinsic level lies $e{\varphi }_F$ above the semiconductor chemical potential. A positive surface potential ${\psi }_s$ lowers both band edges by $e{\psi }_s$, giving, in the nondegenerate approximation,At ${\psi }_s={\varphi }_F$, the surface is intrinsic: $n_s=p_s=n_i$. The usual onset of strong inversion instead meansThus the surface electron density has grown to the bulk majority-carrier density. The chemical potential need not actually enter the conduction band. The phrase “just forms” can also refer to the earlier weak-inversion crossover; the diagram uses the conventional strong-inversion threshold and labels it explicitly.

Within the depletion approximation the negative space charge is approximately $-e{N}_A$ over a widthwhere ${ϵ}_s$ is the absolute semiconductor permittivity. Its outer edge is where the bands become flat and mobile electron holes recover their bulk density. The electrical insulator blocks steady carrier transport while sustaining an electric field; the metal gate supplies positive surface charge balancing depletion and inversion charge. Under gate bias, the gate and substrate electrochemical potentials are different, so a single equilibrium Fermi level should not be drawn through the whole biased stack.

A solar cell uses the photovoltaic effect to turn photon energy into electrical work. In a semiconductor, above-gap photon absorption generates an electron in the conduction band and an electron hole in the valence band. A p-n junction, together with selective electrical contacts, collects the two carrier species at opposite terminals. Carrier diffusion and the built-in electric field help separate them before electron-hole recombination. Illumination maintains different quasi-Fermi levels for electrons and electron holes; their splitting, divided by $e$, sets the available terminal voltage in an ideal device. The equilibrium built-in potential alone cannot continuously deliver work.

For an ideal junction, the illuminated output current density isHere $J_{\mathrm{sc}}$ is the photogenerated short-circuit current density and $J_0$ the diode saturation current. The useful operating point maximizes $VJ$, rather than either current or voltage separately. With solar-cell fill factor $\mathrm{FF}=P_{\max }/(V_{\mathrm{oc}}{I}_{\mathrm{sc}})$,Series resistance, shunts, incomplete photon absorption and nonradiative recombination reduce the attainable efficiency.

The Shockley-Queisser limit removes these avoidable losses but retains the following physical constraints. There is one semiconductor junction with one band gap; each absorbed above-gap photon yields at most one collected electron-hole pair; carriers thermalize to the cell temperature; and the inverse optical process produces unavoidable radiative recombination. If ${\Phi }_{\odot }(E)$ is the incident photon flux per unit energy, ideal photon absorption givesThe same ability to absorb light requires the junction to emit it. At a forward voltage $V$, the emitted photon population has a chemical potential $eV$; in the ordinary nondegenerate limit the resulting recombination current is the exponential diode term above. Maximizing $VJ$ with this radiative $J_0$, and then choosing $E_g$, gives the limiting efficiency.

A small band gap collects many photons but gives a low voltage and large thermalization losses. A large band gap permits a larger voltage but transmits too much of the incident spectrum. Below-gap photons are lost to transmission, excess photon energy above the gap becomes heat, and radiative emission and its associated entropy loss keep $e{V}_{\mathrm{oc}}$ below $E_g$. The optimum single-junction conversion is roughly thirty percent under ordinary unconcentrated sunlight; the precise ceiling depends on spectrum, cell temperature and optical geometry. The original detailed-balance calculation gave about $30\%$ at $E_g\simeq 1.1\mathrm{eV}$ under its specified assumptions.^[ref] Multiple junctions and optical concentration change the assumptions and consequently change the bound.